STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 59

• Manufacturer Part Number: STM32F103ZET6TR
• Description: MCU 32BIT ARM 512K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZET6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 21 Channel
• On-chip Dac: 12 bit, 2 Channel
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 112
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103xC, STM32F103xD, STM32F103xE
Low-speed internal (LSI) RC oscillator
Table 26.
1. V
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Wakeup time from low-power mode
The wakeup times given in
oscillator. The clock source used to wake up the device depends from the current operating
mode:
●
●
All timings are derived from tests performed under ambient temperature and V
voltage conditions summarized in
Table 27.
1. The wakeup times are measured from the wakeup event to the point in which the user application code
I
t
Symbol
DD(LSI)
t
t
su(LSI)
t
WUSTDBY
WUSLEEP
reads the first instruction.
WUSTOP
f
Symbol
LSI
DD
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
(2)
= 3 V, T
(3)
(3)
(1)
(1)
(1)
LSI oscillator characteristics
Low-power mode wakeup timings
Frequency
LSI oscillator startup time
LSI oscillator power consumption
A
= –40 to 105 °C unless otherwise specified.
Wakeup from Sleep mode
Wakeup from Stop mode (regulator in run mode)
Wakeup from Stop mode (regulator in low power mode)
Wakeup from Standby mode
Parameter
Table 27
Doc ID 14611 Rev 7
Table
is measured on a wakeup phase with a 8-MHz HSI RC
Parameter
10.
(1)
Min
30
0.65
Typ
40
Electrical characteristics
Max
1.2
60
85
Typ
1.8
3.6
5.4
50
DD
supply
Unit
kHz
Unit
µA
µs
59/123
µs
µs
µs