PIC18F4455-I/P Microchip Technology, PIC18F4455-I/P Datasheet - Page 27

IC PIC MCU FLASH 12KX16 40DIP

PIC18F4455-I/P

Manufacturer Part Number
PIC18F4455-I/P
Description
IC PIC MCU FLASH 12KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4455-I/P

Program Memory Type
FLASH
Program Memory Size
24KB (12K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI/I2C/EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
35
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163025
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDDVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4455-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F4455-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4455-I/PT
Manufacturer:
MICROCH
Quantity:
20 000
2.2.2
In HS, HSPLL, XT and XTPLL Oscillator modes, a
crystal or ceramic resonator is connected to the OSC1
and OSC2 pins to establish oscillation. Figure 2-2
shows the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
FIGURE 2-2:
© 2009 Microchip Technology Inc.
Note 1: See Table 2-1 and Table 2-2 for initial values of
Note:
C1
C2
2: A series resistor (R
3: R
(1)
(1)
C1 and C2.
strip cut crystals.
CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s
specifications.
F
varies with the oscillator mode chosen.
XTAL
R
S
(2)
OSC2
OSC1
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, HS OR HSPLL
CONFIGURATION)
S
) may be required for AT
R
F
(3)
PIC18FXXXX
Sleep
PIC18F2455/2550/4455/4550
To
Internal
Logic
TABLE 2-1:
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following Table 2-2 for additional
information.
When using ceramic resonators with frequencies
above 3.5 MHz, HS mode is recommended over XT
mode. HS mode may be used at any V
the controller is rated. If HS is selected, the gain of the
oscillator may overdrive the resonator. Therefore, a
series resistor should be placed between the OSC2
pin and the resonator. As a good starting point, the
recommended value of RS is 330 Ω.
DD
Mode
HS
XT
and temperature range for the application.
Typical Capacitor Values Used:
16.0 MHz
4.0 MHz
8.0 MHz
Freq
Resonators Used:
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
16.0 MHz
4.0 MHz
8.0 MHz
OSC1
33 pF
27 pF
22 pF
DS39632E-page 25
DD
for which
OSC2
33 pF
27 pF
22 pF

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