PIC18F452-I/P Microchip Technology, PIC18F452-I/P Datasheet - Page 12

IC MCU FLASH 16KX16 EE 40DIP

PIC18F452-I/P

Manufacturer Part Number
PIC18F452-I/P
Description
IC MCU FLASH 16KX16 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F452-I/P

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PIC18F452I/P
Q1176145

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PIC18FXX2/XX8
TABLE 3-4:
DS39576C-page 12
Step 1: Direct access to config memory.
Step 2: Configure device for multi-panel writes.
Step 3: Direct access to code memory.
Step 4: Load write buffer for Panel 1.
Step 5: Repeat for Panel 2.
Step 6: Repeat for all but the last panel (N – 1).
Step 7: Load write buffer for last panel.
To continue writing data, repeat steps 2 through 5, where the Address Pointer is incremented by 8 in each panel at each iteration of
the loop.
Command
0000
0000
0000
0000
0000
0000
0000
0000
0000
1100
0000
0000
0000
0000
0000
0000
0000
0000
1101
1101
1101
1100
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
4-Bit
8E A6
8C A6
86 A6
0E 3C
6E F8
0E 00
6E F7
0E 06
6E F6
00 40
8E A6
9C A6
0E <Addr[21:16]>
6E F8
0E <Addr[15:8]>
6E F7
0E <Addr[7:0]>
6E F6
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
0E <Addr[21:16]>
6E F8
0E <Addr[15:8]>
6E F7
0E <Addr[7:0]>
6E F6
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
00 00
WRITE CODE MEMORY CODE SEQUENCE
Data Payload
BSF
BSF
BSF
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 06h
MOVWF TBLPTRL
Write 40h to 3C0006h to enable multi-panel writes.
BSF
BCF
MOVLW <Addr[21:16]>
MOVWF TBLPTRU
MOVLW <Addr[15:8]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes
MOVLW <Addr[21:16]>
MOVWF TBLPTRU
MOVLW <Addr[15:8]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and start programming
NOP - hold SCLK high for time P9
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
EECON1, EEPGD
EECON1, CFGS
Core Instruction
 2010 Microchip Technology Inc.

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