PIC18F6410-I/PT Microchip Technology, PIC18F6410-I/PT Datasheet - Page 16

IC PIC MCU FLASH 8KX16 64TQFP

PIC18F6410-I/PT

Manufacturer Part Number
PIC18F6410-I/PT
Description
IC PIC MCU FLASH 8KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6410-I/PT

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
54
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI/I2C/EUSART/AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Package
64TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6410-I/PT
Manufacturer:
RENESAS
Quantity:
340
Part Number:
PIC18F6410-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F6410-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F8410/8490/8493 FAMILY
3.5
The PIC18F8410/8490/8493 family devices do not
have
PIC18F8310/8410
Microprocessor with Boot Block mode, the locations
from 0000h to 07FFh will be internal memory. This
memory region is programmed in exactly the same
manner as the code memory (see Section 3.3 “Code
Memory Programming”).
TABLE 3-5
FIGURE 3-8:
DS39624C-page 16
Step 1: Direct access to config memory.
Step 2: Set Table Pointer for config byte to be written. Write even addresses.
Command
0000
0000
0000
0000
0000
0000
0000
0000
1111
0000
0000
1111
0000
4-Bit
any
Boot Block Programming
Boot
84 A6
8C A6
0E 30
6E F8
0E 00
6E F7
0E 00
6E F6
<LSB><MSB ignored>
00 00
2A F6
<LSB ignored><MSB>
00 00
SET ADDRESS POINTER TO CONFIGURATION LOCATION
devices
Block
CONFIGURATION PROGRAMMING FLOW
Data Payload
Hold PGC High for a
Configuration
Load Even
P9 Time
Program
Address
Done
Start
LSB
segment.
are
configured
BSF
BSF
MOVLW 30h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPRTH
MOVLW 00h
MOVWF TBLPTRL
Load 2 bytes and start programming
NOP - hold PGC high for time P9
INCF
Load 2 bytes and start programming
NOP - hold PGC high for time P9
When
EECON1, WREN
EECON1, CFGS
TBLPTRL
the
in
The code sequence detailed in Table 3-3 should be
used, except that the address data used in “Step 2” will
be in the range 000000h to 0007FFh.
3.6
Unlike code memory, the configuration bits are
programmed a byte at a time. The write operation
programs only 8 bits of the 16-bit payload written. The
LSB of the payload will be written to even addresses
and the MSB will be written to odd addresses. The
code
configuration locations is shown in Table 3-5.
sequence
Core Instruction
Configuration Bits Programming
Hold PGC High for a
Configuration
Load Odd
Program
P9 Time
Address
Done
MSB
Start
to
© 2007 Microchip Technology Inc.
program
two
consecutive

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