PIC18F25J11-I/ML Microchip Technology, PIC18F25J11-I/ML Datasheet - Page 6

• Manufacturer Part Number: PIC18F25J11-I/ML
• Description: IC PIC MCU FLASH 32K 2V 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F25J11-I/ML

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC18
• No. Of I/o's: 16
• Ram Memory Size: 3.6875KB
• Cpu Speed: 48MHz
• No. Of Timers: 5
• Interface: EUSART, I2C, SPI
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3776 B
• Interface Type: EUSART, I2C, SPI
• Maximum Clock Frequency: 48 MHz
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180023
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18F46J11 FAMILY
9. Module: Master Synchronous Serial Port
10. Module: 10-Bit Analog-to-Digital
DS80435H-page 6
When MSSP1 is used in I
data and clock signals are present on the RC3 and
RC4 pins. The RB4 and RB5 pins, however, may
have extraneous pulses that prevent them from
being used normally.
Work around
The RC3 and RC4 pins retain the correct clock and
data signals, so the device should be connected to
the I
remains cleared, RB5 can be used as a general
purpose output pin under normal firmware control.
This issue applies only to MSSP1 when used in
the I
No work around is necessary if MSSP1 is used in
an SPI mode or if MSSP2 is used.
Affected Silicon Revisions
At high V
forming an A/D conversion on Channel 15 (the
V
the reference voltage supplied to the HLVD
module and comparator module (only when
configured to use the V
At lower V
less or non-existent.
Work around
If precise HLVD or comparator V
are required at high V
forming A/D conversions on Channel 15 while
simultaneously using the HLVD or comparator,
V
Channel 15, a settling time of approximately
100 s is needed before the reference voltage
fully returns to the original value.
Affected Silicon Revisions
BG
IRV
A2
A2
X
X
2
. If an A/D conversion is performed on
absolute reference) can temporarily disturb
2
C mode.
C bus through these pins. If TRISB<5>
A4
A4
X
DD
(MSSP) – Port 1
Converter (A/D) – Band Gap
Reference
DD
voltages (for example, > 2.5V), per-
voltages, the disturbance will be
IRV
DD
).
voltages, avoid per-
2
C mode, the correct
IRV
thresholds
11. Module: Charge Time Measurement Unit
On “F” devices, the CTMU current source will
stop sourcing current if the applied V
falls below the LVDSTAT (WDTCON<6>)
threshold (2.45V nominal). When V
the LVDSTAT threshold, the CTMU will function
normally.
This issue does not apply to “LF” devices. The
current source will continue functioning normally
at all rated voltages for these devices.
Work around
None.
Affected Silicon Revisions
A2
X
A4
(CTMU)
 2010 Microchip Technology Inc.
DD
DD
is above
voltage