PIC18F14K22-I/SO Microchip Technology, PIC18F14K22-I/SO Datasheet - Page 306

• Manufacturer Part Number: PIC18F14K22-I/SO
• Description: IC PIC MCU FLASH 512KX16 20-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F14K22-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 20-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, MSSP, SPI, USART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 2.05 mm
• Length: 12.8 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V, 2.7 V
• Width: 7.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F1XK22/LF1XK22
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS41365D-page 306
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
POP
None
(TOS)  bit bucket
None
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
1
1
POP
GOTO
0000
Q2
No
0000
NEW
POP TOS
=
=
=
=
value
Q3
0031A2h
014332h
014332h
NEW
0000
operation
Q4
No
0110
Preliminary
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
PUSH
None
(PC + 2)  TOS
None
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
1
1
PUSH
PUSH
0000
Q2
 2010 Microchip Technology Inc.
0000
operation
=
=
=
=
=
Q3
No
345Ah
0126h
345Ah
0124h
0126h
0000
operation
Q4
No
0101