PIC18F24K20-I/SS Microchip Technology, PIC18F24K20-I/SS Datasheet - Page 9

• Manufacturer Part Number: PIC18F24K20-I/SS
• Description: IC PIC MCU FLASH 8KX16 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F24K20-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: CCP/ECCP/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Package: 28SSOP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 64 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F24/25/44/45K20
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev A Document (02/2008)
First revision of this document.
Rev B Document (05/12/08)
Added Module 20: POR, updating subsequent
numbering. Updated Module 5: ADC, Work around
2
description. Added Module 8 MSSP I
C, updating
subsequent numbering. Revised Module 22: Clocks,
added silicon revs.
Rev C Document (08/2008)
Revised Module 22; Added Modules 27 and 28.
Rev D Document (01/2009)
Revised Module 21; Added Module 29.
Rev E Document (05/2009)
Updated Errata to new format; Deleted Module 8:
2
MSSP I
C and Module 23: Comparators; Renumbered
Modules; Added Module 28: ADC; minor edits.
Clarifications/Corrections to the Data Sheet: Added
Module 1: MSSP; Module 2: Electrical Specifications;
Module 3: Electrical Specifications.
Rev F Document (06/2009)
Clarifications/Corrections to the Data Sheet:
Deleted Module 1: MSSP: Figure 17-17 Baud Rate
Generator Block Diagram, updating subsequent num-
bering. Added Module 3 MSSP: Register 17-3
SSPADD; Added Module 4 MSSP: Section 17.4.2
Operation; Added Module 5 MSSP: Figure 17-16
MSSP Block Diagram; Added Module 6 MSSP: Sec-
tions 17.4.7.1, 17.4.8, 17.4.9, 17.4.17.1, 17.4.17.2,
17.4.17.3: SSPADD, changing <6:0> to <7:0>.
Rev G Document (10/2009)
Updated the title of the errata.
Data Sheet Clarifications: Updated the errata deleting
Modules 1, 2, 3, 4, 5, 6.
© 2009 Microchip Technology Inc.
DS80366G-page 9