PIC16F723-I/SS Microchip Technology, PIC16F723-I/SS Datasheet - Page 11

• Manufacturer Part Number: PIC16F723-I/SS
• Description: IC PIC MCU FLASH 4KX14 28-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F723-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164307 - MODULE SKT FOR PM3 28SSOP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Fixed Voltage Reference......................................................................................................................................................... 107
11.0 Timer0 Module ........................................................................................................................................................................ 109
12.0 Timer1 Module with Gate Control............................................................................................................................................ 113
13.0 Timer2 Module ........................................................................................................................................................................ 125
14.0 Capacitive Sensing Module..................................................................................................................................................... 127
15.0 Capture/Compare/PWM (CCP) Module .................................................................................................................................. 133
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) .......................................................... 143
17.0 SSP Module Overview ............................................................................................................................................................ 165
18.0 Program Memory Read ........................................................................................................................................................... 187
19.0 Power-Down Mode (Sleep) ..................................................................................................................................................... 191
20.0 In-Circuit Serial Programming™ (ICSP™) .............................................................................................................................. 193
21.0 Instruction Set Summary ......................................................................................................................................................... 195
22.0 Development Support.............................................................................................................................................................. 205
23.0 Electrical Specifications........................................................................................................................................................... 209
24.0 DC and AC Characteristics Graphs and Charts ...................................................................................................................... 239
25.0 Packaging Information............................................................................................................................................................. 241
Appendix A: Data Sheet Revision History......................................................................................................................................... 253
Appendix B: Migrating From Other PIC
Index ................................................................................................................................................................................................. 255
The Microchip Web Site .................................................................................................................................................................... 261
Customer Change Notification Service ............................................................................................................................................. 261
Customer Support ............................................................................................................................................................................. 261
Reader Response ............................................................................................................................................................................. 262
Product Identification System ........................................................................................................................................................... 263
© 2008 Microchip Technology Inc.
Device Overview ....................................................................................................................................................................... 11
Memory Organization ................................................................................................................................................................ 17
Resets ....................................................................................................................................................................................... 31
Interrupts ................................................................................................................................................................................... 41
Low Dropout (LDO) Voltage Regulator ..................................................................................................................................... 49
I/O Ports .................................................................................................................................................................................... 51
Oscillator Module....................................................................................................................................................................... 87
Device Configuration ................................................................................................................................................................. 93
Analog-to-Digital Converter (ADC) Module ............................................................................................................................... 97
®
Devices............................................................................................................................. 253
Preliminary
PIC16F72X/PIC16LF72X
DS41341B-page 9