NIF9N05CL ON Semiconductor, NIF9N05CL Datasheet

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NIF9N05CL

Manufacturer Part Number
NIF9N05CL
Description
Protected Power MOSFET
Manufacturer
ON Semiconductor
Datasheet

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NIF9N05CL
Protected Power MOSFET
2.6 A, 52 V, N−Channel, Logic Level,
Clamped MOSFET w/ ESD Protection
in a SOT−223 Package
Benefits
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to a FR4 board using 1″ pad size, (Cu area 1.127 in
2. When surface mounted to a FR4 board using minimum recommended pad
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 5
MAXIMUM RATINGS
Drain−to−Source Voltage Internally Clamped
Gate−to−Source Voltage − Continuous
Drain Current
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain−to−Source
Avalanche Energy (V
A, V
Thermal Resistance,
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
Solenoid Drivers, Lamp Drivers, Small Motor Drivers
High Energy Capability for Inductive Loads
Low Switching Noise Generation
Diode Clamp Between Gate and Source
ESD Protection − HBM 5000 V
Active Over−Voltage Gate to Drain Clamp
Scalable to Lower or Higher R
Internal Series Gate Resistance
Pb−Free Packages are Available
Automotive and Industrial Markets:
size, (Cu area 0.412 in
− Continuous @ T
− Single Pulse (t
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
GS
= 10 V, L = 160 mH, R
Rating
p
DD
A
= 10 ms) (Note 1)
= 25°C
= 50 V, I
2
(T
).
J
A
= 25°C unless otherwise noted)
= 25°C (Note 1)
G
= 25 W)
D(pk)
DS(on)
= 1.17
Symbol
T
V
R
R
J
V
E
I
P
, T
T
DSS
DM
I
qJA
qJA
GS
AS
D
D
L
stg
−55 to 150
52−59
Value
www.DataSheet4U.com
1.69
±15
110
169
260
2.6
10
74
1
°C/W
Unit
mJ
°C
°C
W
V
V
A
2
).
(Pin 1)
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Gate
(Clamped)
V
52 V
(Note: Microdot may be in either location)
DSS
SOURCE
ESD Protection
A
Y
W
F9N05 = Specific Device Code
G
DRAIN
ORDERING INFORMATION
GATE
R
MARKING DIAGRAM
G
http://onsemi.com
= Assembly Location
= Year
= Work Week
= Pb−Free Package
R
Overvoltage
1
2
3
Protection
DS(ON)
(Top View)
107 mW
Publication Order Number:
TYP
CASE 318E
SOT−223
STYLE 3
4
NIF9N05CL/D
DRAIN
(Pins 2, 4)
I
D
Source
2.6 A
(Pin 3)
Drain
MAX
M
PWR

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NIF9N05CL Summary of contents

Page 1

... Source (Pin 3) SOT−223 CASE 318E STYLE 3 MARKING DIAGRAM 1 GATE 4 2 DRAIN DRAIN 3 SOURCE (Top View Assembly Location Y = Year W = Work Week F9N05 = Specific Device Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Publication Order Number: NIF9N05CL/D PWR ...

Page 2

... DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance Input Capacitance Output Capacitance Transfer Capacitance 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperatures. NIF9N05CL (T = 25°C unless otherwise noted) J Symbol 2 ...

Page 3

... SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage Reverse Recovery Time Reverse Recovery Stored Charge ESD CHARACTERISTICS Electro−Static Discharge Capability 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperatures. NIF9N05CL (T = 25°C unless otherwise noted) J Symbol t d(on ...

Page 4

... Figure 3. On−Resistance vs. Gate−to−Source Voltage I = 2 1.7 1.5 1.3 1.1 0.9 0.7 0.5 −50 − JUNCTION TEMPERATURE (°C) J Figure 5. On−Resistance Variation with Temperature NIF9N05CL TYPICAL PERFORMANCE CURVES 25°C J ≥ 25° 0. 25° ...

Page 5

... Figure 9. Resistance Switching Time Variation vs. Gate Resistance ORDERING INFORMATION Device NIF9N05CLT1 NIF9N05CLT1G NIF9N05CLT3 NIF9N05CLT3G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NIF9N05CL TYPICAL PERFORMANCE CURVES 25° ...

Page 6

... E 0° − 10° 0° − 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NIF9N05CL/D MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° ...

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