C1206C122J1GACTU Kemet, C1206C122J1GACTU Datasheet - Page 2
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C1206C122J1GACTU
Manufacturer Part Number
C1206C122J1GACTU
Description
CAP CER 1200PF 100V C0G 1206
Manufacturer
Kemet
Series
C1206r
Specifications of C1206C122J1GACTU
Capacitance
1200pF
Voltage - Rated
100V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
0.78mm
Voltage Rating
100 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
C0G (NP0)
Product
General Type MLCCs
Dimensions
1.6 mm W x 3.2 mm L x 1.5 mm H
Dissipation Factor Df
0.1
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
C1206C122J1GAC
C1206C122J1GAC7800
C1206C122J1GAC7800
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
RoHS compliant
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Code
Size
0603
0201
0402
0805
1206
1210
1808
1825
2220
2225
EIA
1812
Metric
Code
Size
0603
4532
4564
5650
5664
1005
1608
2012
3216
3225
4520
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
0.60 (.024) ± 0.03 (.001) 0.30 (.012) ± 0.03 (.001)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
Length
L
Width
W
Thickness
T
0.15 (.006) ± 0.05 (.002)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
Bandwidth
T
B
W
S
L
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
B
Min.
N/A
N/A
S
C1003_C0G • 5/27/2011
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Mounting
100% Tin or SnPb Plate
Nickel Plate
2