CC0603JRNPO8BN102 Yageo, CC0603JRNPO8BN102 Datasheet - Page 13

• Manufacturer Part Number: CC0603JRNPO8BN102
• Description: CAP CERAMIC .001UF 25V NPO 0603
• Manufacturer: Yageo
• Series: CCr

Specifications of CC0603JRNPO8BN102

• Capacitance: 1000pF
• Voltage - Rated: 25V
• Tolerance: ±5%
• Temperature Coefficient: C0G, NP0
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.80mm
• Dielectric Characteristic: C0G / NP0
• Capacitance Tolerance: ± 5%
• Voltage Rating: 25VDC
• Capacitor Case Style: 0603
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Other names: 311-1342-2; CC0603JRNP08BN102

Jan 06, 2011 V6
TEST
Resistance to
soldering heat
Solderability
Rapid change
of
temperature
Surface-Mount Ceramic Multilayer Capacitors
TEST METHOD
IEC 60384-
21/22
4.9
4.10
4.11
PROCEDURE
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ±2 hours
General Purpose
REQUIREMENTS
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General purpose series>
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
R
The solder should cover over 95% of
the critical area of each termination
No visual damage
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
D.F. meet initial specified value
R
ins
ins
within initial specified value
meet initial specified value
NP0
16 V to 50 V
Product specification
www.yageo.com
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