LLM215C70G155ME11L Murata Electronics North America, LLM215C70G155ME11L Datasheet - Page 147

• Manufacturer Part Number: LLM215C70G155ME11L
• Description: CAP CER 1.5UF 4V X7S 0805 LP
• Manufacturer: Murata Electronics North America
• Series: LLMr

Specifications of LLM215C70G155ME11L

• Capacitance: 1.5µF
• Voltage - Rated: 4V
• Tolerance: ±20%
• Temperature Coefficient: X7S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESL, Multi-Terminal
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.50mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 490-4483-2

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Soldering and Mounting
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
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