GRM55ER71E156MA01L Murata Electronics North America, GRM55ER71E156MA01L Datasheet - Page 143
![CAP CER 15UF 25V 20% X7R 2220](/photos/10/48/104854/2220_murata_mlcc_caps_sml.jpg)
GRM55ER71E156MA01L
Manufacturer Part Number
GRM55ER71E156MA01L
Description
CAP CER 15UF 25V 20% X7R 2220
Manufacturer
Murata Electronics North America
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM55ER71E156MA01L
Capacitance
15µF
Voltage - Rated
25V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
2220 (5750 Metric)
Size / Dimension
0.224" L x 0.197" W (5.70mm x 5.00mm)
Thickness
2.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
490-1946-2
- Current page: 143 of 221
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
2. Ascertain of the cropping method for the printed circuit
!Caution
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure
1-2. Avoid vibration of the board by shock when a test pin
not apply any stress to the capacitor that is caused by
bending or twisting the board.
1-1. In cropping the board, the stress as shown right may
board in advance.
2-1. Printed circuit board cropping shall be carried out by
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
of a test pin, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing.
contacts a printed circuit board.
cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
using a jig or an apparatus to prevent the mechanical
stress that can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be
pushed as close to the cropping jig as possible
and from the back side of board in order to
minimize the compressive stress applied to
capacitor.
Not recommended example: when the board is
pushed at a point far from the cropping jig and
from the front side of board as below, the
capacitor may form a crack caused by the tensile
stress applied to capacitor.
Printed Circuit Board
Recommended
Components
Load Point
Direction of Load
[Not Recommended]
[Recommended]
[Outline of Jig]
Printed Circuit Board
Printed Circuit Board
[Bending]
[Twisting]
Load Point
Not recommended
Components
Continued on the following page.
Test-pin
Board Cropping Jig
Test-pin
Direction of Load
V-groove
Peeling
!Caution
Support Pin
141
C02E.pdf
10.12.20
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