C4532C0G2A683J TDK Corporation, C4532C0G2A683J Datasheet - Page 24
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C4532C0G2A683J
Manufacturer Part Number
C4532C0G2A683J
Description
CAP CER 68000PF 100V C0G 5% 1812
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(1 pages)
2.C1608X7R2A102K.pdf
(26 pages)
3.C3216X7R1E155K.pdf
(17 pages)
Specifications of C4532C0G2A683J
Capacitance
0.068µF
Tolerance
±5%
Package / Case
1812 (4532 Metric)
Voltage - Rated
100V
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.177" L x 0.126" W (4.50mm x 3.20mm)
Thickness
2.50mm
Voltage Rating
100 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
C0G (NP0)
Product
General Type MLCCs
Dimensions
3.2 mm W x 4.5 mm L x 2.5 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-2355-2
C4532C0G2A683JT
C4532COG2A683J
C4532C0G2A683JT
C4532COG2A683J
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Mid Voltage Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.35 - 0.45
[CC0603]
[CC0402]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C1005
C3216
Chip capacitor
A
[CC0805]
[CC0603]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1608
C3225
Solder land
[CC1206]
[CC0805]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
Unit: mm
C2012
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C5750
C Series — Mid Voltage Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling