C3216X5R0J226K/1.6 TDK Corporation, C3216X5R0J226K/1.6 Datasheet - Page 60
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C3216X5R0J226K/1.6
Manufacturer Part Number
C3216X5R0J226K/1.6
Description
CAP CER 22UF 6.3V X5R 10% 1206
Manufacturer
TDK Corporation
Series
Cr
Specifications of C3216X5R0J226K/1.6
Capacitance
22µF
Voltage - Rated
6.3V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Low ESR
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
1.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-4059-2
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — General Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.25 - 0.35
0.25 - 0.35
[CC0603]
[CC0201]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.2 - 0.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C0603
C3216
Chip capacitor
A
0.35 - 0.45
[CC0805]
[CC0402]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1005
C3225
Solder land
[CC1206]
[CC0603]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
C1608
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC0805]
[CC2220]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C2012
Unit: mm
C5750
C Series — General Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling