CLLE1AX7R0J155M TDK Corporation, CLLE1AX7R0J155M Datasheet - Page 11
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CLLE1AX7R0J155M
Manufacturer Part Number
CLLE1AX7R0J155M
Description
CAP LOW ESL 1.5UF 6.3V X7R 0805
Manufacturer
TDK Corporation
Series
CLLr
Datasheet
1.CLLE1AX7R1A104M.pdf
(13 pages)
Specifications of CLLE1AX7R0J155M
Capacitance
1.5µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESL, Multi-Terminal
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.95mm Max
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-3402-2
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
B
A
B
C
D
P
Type
Soldering
Information
A
(C1608/CC0603)
CLLC1A
0.25
0.4
1.2
0.4
0.4
CLL Series — Ultra Low Inductance Capacitors
P
Minimum amount
Maximum amount
(C2012/CC0805)
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
CLLE1A
0.3 ~ 0.6
1.3 ~ 1.8
0.5 ~ 0.8
D C
0.3
0.5
Unit: mm
Peak
Temp
US Catalog // CLL Series — Ultra Low Inductance Capacitors // Version A11
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
230 max.
260 max.
(°C)
Reflow Soldering
Temp. (ºC)
300
∆T ≤ 150
∆T ≤ 150
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)