C0805C335Z8VACTU Kemet, C0805C335Z8VACTU Datasheet - Page 2

• Manufacturer Part Number: C0805C335Z8VACTU
• Description: CAP 3.3UF 10V CER Y5V SMD 0805
• Manufacturer: Kemet
• Series: C0805r

Specifications of C0805C335Z8VACTU

• Capacitance: 3.3µF
• Voltage - Rated: 10V
• Tolerance: -20%, +80%
• Temperature Coefficient: Y5V (F)
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -30°C ~ 85°C
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.00mm
• Voltage Rating: 10 Volts
• Operating Temperature Range: - 30 C to + 85 C
• Temperature Coefficient / Code: Y5V
• Product: General Type MLCCs
• Dimensions: 1.25 mm W x 2 mm L x 1.3 mm H
• Dissipation Factor Df: 10
• Lead Spacing: 0.75 mm
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-3222-2; C0805C335Z8VAC; C0805C335Z8VAC7800

Dimensions – Millimeters (Inches)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
Pb-Free and RoHS compliant
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Code
Size
0603
0402
0805
1206
1210
EIA
Metric
Code
Size
1005
1608
2012
3216
3225
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
Length
L
Width
W
Thickness
T
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
Bandwidth
T
B
W
S
L
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
B
Min.
N/A
S
C1005_Y5V • 5/27/2011
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Mounting
100% Tin or SnPb Plate
Nickel Plate
2