C0805C222KARACTU Kemet, C0805C222KARACTU Datasheet - Page 2

• Manufacturer Part Number: C0805C222KARACTU
• Description: CAP CERAMIC 2200PF 250V X7R 0805
• Manufacturer: Kemet
• Series: C0805r

Specifications of C0805C222KARACTU

• Capacitance: 2200pF
• Voltage - Rated: 250V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.78mm
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: General Type MLCCs
• Dimensions: 1.25 mm W x 2 mm L x 1.3 mm H
• Lead Spacing: 0.75 mm
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-4667-2; C0805C222KARAC; C0805C222KARAC7867

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250VDC, (Commercial Grade)
Dimensions – Millimeters (Inches) Standard Termination
Dimensions – Millimeters (Inches) Flexible Termination option
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
Pb-Free and RoHS compliant (excluding SnPb termination finish option)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Code
Code
Size
Size
0805
1206
1825
2220
2225
EIA
1210
1812
0805
1206
1210
1825
2220
2225
EIA
1812
Metric
Metric
Code
Code
Size
4564
5650
5664
Size
2012
3216
3225
4532
4532
4564
5650
5664
2012
3216
3225
2.10 (.083) +0.30 (.012)
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
5.9 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016)
5.9 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
3.3 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)
3.3 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)
4.5 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)
4.6 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
/ -0.20 (.008)
L Length
Length
L
1.25 (.049) ± 0.20 (.008)
W Width
Width
W
Thickness
Thickness
T
T
0.60 (.024) ± 0.25 (.010)
0.60 (.024) ± 0.25 (.010)
0.70 (.028) ± 0.35 (.014)
0.70 (.028) ± 0.35 (.014)
0.70 (.028) ± 0.35 (.014)
0.70 (.028) ± 0.35 (.014)
0.50 (0.02) +0.10(.004)/
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
B Bandwidth
Bandwidth
-0.25 (.010)
T
B
W
S
T
W
S
L
Separation
Separation
L
Minimum
Minimum
0.75 (.030)
0.50 (.020)
0.70 (.028)
B
N/A
N/A
C1011_X7RT&R • 5/27/2011
S
S
B
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Solder Reflow
Technique
Mounting
Mounting
100% Tin or SnPb Plate
Nickel Plate
2