JMK316BJ106KF-T Taiyo Yuden, JMK316BJ106KF-T Datasheet - Page 48
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JMK316BJ106KF-T
Manufacturer Part Number
JMK316BJ106KF-T
Description
CAP CER 10UF 6.3V X5R 1206
Manufacturer
Taiyo Yuden
Series
JMKr
Specifications of JMK316BJ106KF-T
Capacitance
10µF
Voltage - Rated
6.3V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
1.15mm
Dielectric Characteristic
X5R
Capacitance Tolerance
± 10%
Voltage Rating
6.3VDC
Capacitor Case Style
1206
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
587-1344-2
CE JMK316 BJ106KF-T
CE JMK316 BJ106KF-T
mlcc_prec-P1
■
Precautions on the use of Multilayer Ceramic Capacitors
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
1. Circuit Design
2. PCB Design
Precautions
Precautions
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
◆Verification of operating environment, electrical rating and performance
◆Operating Voltage (Verification of Rated voltage)
◆Pattern configurations (Design of Land-patterns)
◆Pattern configurations ( Capacitor layout on PCBs)
◆Pattern configurations (Design of Land-patterns)
(1) Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
(2) When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
(1) Recommended land dimensions for typical chip capacitors
(2) Examples of good and bad solder application
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
1. The operating voltage for capacitors must always be their rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
1. When capacitors are mounted on PCBs, the amount of solder used (size of fillet) can directly affect the capacitor performance. Therefore, the following items must
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.) . For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
having rapid rise time is used in a circuit.
be carefully considered in the design of land patterns:
amount of solder.
●Multilayer Ceramic Capacitors : Recommended land dimensions (unit: mm)
Wave-soldering
●LWDC: Recommended land dimensions for reflow-soldering (unit: mm)
●Array type: Recommended land dimensions for reflow-soldering (unit: mm)
Reflow-soldering
Size
Size
Size
Size
Mixed mounting of
placement close to
SMD and leaded
Hand-soldering
Type
Type
Type
Type
near mounted
components
components
components
B
C
B
C
Component
A
A
C
the chassis
component
A
B
a
b
c
d
placement
Horizontal
of leaded
W
W
Items
L
L
W
W
L
L
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
096 (2 circuits) 110 (2 circuits) 212 (2 circuits) 212 ( 4 circuits)
0.18 to 0.22
0.2 to 0.25
0.25 to 0.35
0.15 to 0.25
0.15 to 0.25
107
042
0.9 to 1.1
1.6
0.8
0.4
0.2
0.52
105
1.0
0.45
0.9
0.6
51.25
212
063
2.0
0.6
0.3
Not recommended
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.35 to 0.45
0.55 to 0.65
0.3 to 0.4
50.8
107
1.6
1.37
0.64
1.0
316
105
3.2
1.6
1.0
0.5
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
325
107
3.2
2.5
1.6
0.8
1.25
0.5 to 0.6
0.5 to 0.6
0.5 to 0.6
212
2.0
1.25
1.0
2.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
51.25
212
2.0
Recommended
0.5 to 0.6
0.5 to 0.6
0.2 to 0.3
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.25
2.0
0.5
316
3.2
1.6
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
325
3.2
2.5
1 1
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
432
4.5
3.2
Land patterns for PCBs
2 circuits
Chip capacitor
C
Land
Chip capacitor
c
B
Chip capacitor
d
LWDC
L
L
A
a
b
a
Land
B
W
W
4 circuits
c
To next page
mlcc_prec_e-01
Solder-resist
d
a
b
a