GRM55DR72J224KW01L Murata Electronics North America, GRM55DR72J224KW01L Datasheet - Page 2

• Manufacturer Part Number: GRM55DR72J224KW01L
• Description: CAP CER .22UF 630V 10% X7R 2220
• Manufacturer: Murata Electronics North America
• Series: GRMr

Specifications of GRM55DR72J224KW01L

• Capacitance: 0.22µF
• Voltage - Rated: 630V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
• Thickness: 2.00mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 490-3520-2

No.
11 Deflection
12
13
14
15
* "Room condition" Temperature: 15 to 35 C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Medium Voltage High Capacitance for General Use Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
Item
Appearance No marking defects
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance No marking defects
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance No marking defects
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
Within 10%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
Within 7.5%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
Within 15%
0.05 max.
CU0.01 F: More than 10M • F
CF0.01 F: More than 1,000M
In accordance with item No.4
1.6Z0.8
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z3.2
5.7Z5.0
LZW
(mm)
1.0
1.2
2.2
2.2
3.5
4.5
a
Specifications
d
Fig. 2
100
Dimension (mm)
b
a
c
3.0
4.0
5.0
5.0
7.0
8.0
b
4.5
1.2
1.65
2.0
2.9
3.7
5.6
t : 1.6
c
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2 0.5 sec.
Immersing speed: 25 2.5mm/s
Temp. of solder: 245 5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150 C * for 1 min.
Immerse the capacitor in solder solution at 260 5 C for 10 1
sec. Let sit at room condition* for 24 2 hrs., then measure.
*Preheating for more than 3.2Z2.5mm
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24 2 hrs. at room condition,* then measure.
Let the capacitor sit at 40 2 C and relative humidity of 90 to 95%
for 500
Remove and let sit for 24 2 hrs. at room condition,* then
measure.
•Immersing speed: 25 2.5mm/s
•Pretreatment
•Pretreatment
•Pretreatment
Perform a heat treatment at 150
let sit for 24 2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24 2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24 2 hrs. at room condition.*
Step
Step
+24
– 0
1
2
1
2
3
4
hrs.
Max. Operating Temp. 2
Min. Operating Temp. 3
235 5 C H60A or H63A Eutectic Solder
Temperature ( C)
Glass Epoxy Board
Temperature
100 to 120 C
170 to 200 C
R230
Room Temp.
Room Temp.
Capacitance meter
45
Test Method
20 50
Fig. 3
Fig. 4
Continued on the following page.
45
Pressurize
+ 0
–10
+ 0
–10
+ 0
–10
Pressurizing
speed: 1.0mm/s
Flexure=1
C for 60 5 min. and then
C for 60 5 min. and then
C for 60 5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
1 min.
1 min.
2 to 3
2 to 3
Time
30 3
30 3