C4532X7R1H225M TDK Corporation, C4532X7R1H225M Datasheet - Page 59

CAP CER 2.2UF 50V X7R 20% 1812

C4532X7R1H225M

Manufacturer Part Number
C4532X7R1H225M
Description
CAP CER 2.2UF 50V X7R 20% 1812
Manufacturer
TDK Corporation
Series
Cr
Datasheets

Specifications of C4532X7R1H225M

Capacitance
2.2µF
Voltage - Rated
50V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Package / Case
1812 (4532 Metric)
Size / Dimension
0.177" L x 0.126" W (4.50mm x 3.20mm)
Thickness
1.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-1447-2
C4532X7R1H225MT
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
c
C Series — General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
US Catalog // C Series — General Application // Version A11
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c

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