GA342QR7GD471KW01L Murata Electronics North America, GA342QR7GD471KW01L Datasheet - Page 111
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GA342QR7GD471KW01L
Manufacturer Part Number
GA342QR7GD471KW01L
Description
CAP CER 250VAC 470PF X7R 1808
Manufacturer
Murata Electronics North America
Series
GDr
Datasheets
1.GNM1M2R71E472MA01D.pdf
(4 pages)
2.GA342QR7GD471KW01L.pdf
(221 pages)
3.GA342QR7GD471KW01L.pdf
(1 pages)
Specifications of GA342QR7GD471KW01L
Capacitance
470pF
Voltage - Rated
250VAC
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
Safety
Ratings
Y3
Package / Case
1808 (4520 Metric)
Size / Dimension
0.177" L x 0.079" W (4.50mm x 2.00mm)
Thickness
1.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Spacing
-
Other names
490-3487-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GA342QR7GD471KW01L
Manufacturer:
MURATA
Quantity:
640 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
!Note
No.
12
13
14
15
16
GQM Series Specifications and Test Methods
Continued from the preceding page.
Resistance
to Soldering
Heat
Deflection
Solderability of
Termination
Temperature
Cycle
Humidity
Steady
State
1. This Specifications and Test Methods is downloaded from the website of Murata Manufacturing co.,ltd. Therefore, it's specifications are subject to change or our products in it may be discontinued without advance notice.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
0.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
2. This Specifications and Test Methods has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product
0.
Please check with our sales representatives or product engineers before ordering.
specifications before ordering.
Item
Appearance
Capacitance
Change
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities.
Within T5% or T0.5pF
(whichever is larger)
75% of the terminations are to be soldered evenly
and continuously.
The measured and observed characteristics should satisfy the
specifications in the following table.
No defects or abnormalities.
Within T2.5% or T0.25 pF
(whichever is larger)
30pF and over: QU1400
30pF and below: QU800W20C
C: Nominal Capacitance (pF)
More than 10,000MΩ
No defects.
The measured and observed characteristics should satisfy the
specifications in the following table.
No defects or abnormalities.
Within T2.5% or T0.25pF
(whichever is larger)
30pF and over: QU1400
30pF and below: QU800W20C
C: Nominal Capacitance (pF)
More than 10,000MΩ
No defects.
The measured and observed characteristics should satisfy the
specifications in the following table.
No defects or abnormalities.
Within T5% or T0.5pF
(whichever is larger)
30pF and over: QU350
10pF and over, 30pF and below: QU275+5C/2
10pF and below: QU200W10C
C: Nominal Capacitance (pF)
More than 1,000MΩ
GQM18
GQM21
GQM22
Type
Specifications
1.0
1.2
2.2
a
100
Fig. 2
b
c
a
3.0
4.0
5.0
b
4.5
GQM Series Specifications and Test Methods
t: 1.6mm
1.65
1.2
2.9
c
(in mm)
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
80 to 120D for 10 to 30 seconds. After preheating, immerse in
eutectic solder solution for 2T0.5 seconds at 230T5D or
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.
Preheat the capacitor at 120 to 150D for 1 minute. Immerse the
capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder solution
at 270T5D for 10T0.5 seconds. Let sit at room temperature for
24T2 hours, then measure.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Perform the five cycles according to the four heat treatments
listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Set the capacitor at 40T2D and in 90 to 95% humidity for
500T12 hours.
Remove and set for 24T2 hours at room temperature, then
measure.
Temp. (D)
Time (min.)
Step
Min. Operating
Temp. W0/Y3
R230
30T3
1
45
Capacitance meter
Fig. 3
Test Method
20
Temp.
Room
2 to 3
50
Continued on the following page.
Pressurize
45
2
Pressurizing
speed: 1.0mm/sec.
Max. Operating
Temp. W3/Y0
Flexure : V1
30T3
3
Temp.
Room
2 to 3
4
109
C02E.pdf
10.12.20