GCM31A7U2E472JX01D Murata Electronics North America, GCM31A7U2E472JX01D Datasheet - Page 31

• Manufacturer Part Number: GCM31A7U2E472JX01D
• Description: CAP CER 4700PF 250V U2J 1206
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM31A7U2E472JX01D

• Capacitance: 4700pF
• Voltage - Rated: 250V
• Tolerance: ±5%
• Temperature Coefficient: U2J
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: 1206 (3216 Metric)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Thickness: 1.00mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Spacing: -
• Other names: 490-5034-2

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
2. Excessively long soldering time or high soldering
3. When components are immersed in solvent after
4. Do not apply flow soldering to chips not listed in table 2.
Table 2
Recommended Conditions
5. Optimum Solder Amount for Flow Soldering
Preheating Peak Temperature
!Caution
Soldering Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep temperature differential between the solder and
the components surface ( T) as small as possible.
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
mounting, be sure to maintain the temperature difference
( T) between the component and solvent within the range
shown in the table 2.
5-1. The top of the solder fillet should be lower than the
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
GCM18/21/31
Atmosphere
Part Number
Pb-Sn Solder
240 to 250 C
90 to 110 C
Air
Temperature Differential
TV150 C
Lead Free Solder
100 to 120 C
250 to 260 C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Flow Soldering Temperature and Time]
!Caution (Soldering and Mounting)
Temperature (D)
Preheating
Peak
Temperature
Soldering
Peak
Temperature
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220





























0
Adhesive






30-90 seconds
10
Preheating
T
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
Gradual
Cooling
Time
in section
40
C03E.pdf
29
10.5.20
1