C2012X8R1E154K TDK Corporation, C2012X8R1E154K Datasheet - Page 13

• Manufacturer Part Number: C2012X8R1E154K
• Description: CAP CER .15UF 25V X8R 10% 0805
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C2012X8R1E154K

• Capacitance: 0.15µF
• Voltage - Rated: 25V
• Tolerance: ±10%
• Temperature Coefficient: X8R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 150°C
• Features: High Temperature
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.85mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-3430-2; C2012X8R1E154KT

• All specifications are subject to change without notice. Please read the precautions before using the product.
Material : Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness : Appendix-2a
General
Specifications
Applied for C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Appendix - 1a
Appendix - 2a
Applied for C1005
Appendix-1a, 1b, 2b
b
100 mm
Copper
C Series — High Temperature Application
b
a
Copper
0.8mm
1.6mm
c
US Catalog // C Series — High Temperature Application // Version A11
C1005
C1608
C2012
C3216
C3225
JIS
Case Code
c
Applied for C1608, C2012, C3216, C3225
Solder Resist
100 mm
CC0402
CC0603
CC0805
CC1206
CC1210
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
Applied for C3225
b
100 mm
0.4
1.0
1.2
2.2
2.2
a
Solder Resist
a
Dimensions (mm)
Copper
1.5
3.0
4.0
5.0
5.0
b
Copper
1.65
0.5
1.2
2.0
2.9
c