C1632X7R1E224K TDK Corporation, C1632X7R1E224K Datasheet - Page 13

CAP CER .22UF 25V 10% X7R 0612

C1632X7R1E224K

Manufacturer Part Number
C1632X7R1E224K
Description
CAP CER .22UF 25V 10% X7R 0612
Manufacturer
TDK Corporation
Series
Cr
Datasheets

Specifications of C1632X7R1E224K

Capacitance
0.22µF
Tolerance
±10%
Package / Case
1206 (3216 Metric) Wide, 0612 (1632 Metric)
Voltage - Rated
25V
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESL
Applications
General Purpose
Size / Dimension
0.063" L x 0.126" W (1.60mm x 3.20mm)
Thickness
0.70mm
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Low ESR MLCCs
Dimensions
3.200 mm W x 1.600 mm L x 0.700 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-1815-2
C1632X7R1E224KT
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
A
B
C
Type
Soldering
Information
B
[CC0204]
C
C0510
0.20
0.20
1.00
Chip capacitor
A
[CC0306]
C0816
0.30
0.35
1.60
Solder land
[CC0508]
C1220
Maximum amount
Minimum amount
0.50
0.55
2.00
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Solder resist
[CC0612]
Unit: mm
C1632
0.725
0.75
3.20
C Series — Low ESL Flipped Type
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
US Catalog // C Series — Flipped Type // Version A11
cooling
Peak temp
230 max.
260 max.
(°C)
Reflow Soldering
Temp. (ºC)
300
∆T ≤ 150
∆T ≤ 150
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)

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