C0816X5R1A224K TDK Corporation, C0816X5R1A224K Datasheet - Page 12
![CAP CER .22UF 10V 10% X5R 0306](/photos/10/41/104120/940c_series_0306_0816__sml.jpg)
C0816X5R1A224K
Manufacturer Part Number
C0816X5R1A224K
Description
CAP CER .22UF 10V 10% X5R 0306
Manufacturer
TDK Corporation
Series
Cr
Specifications of C0816X5R1A224K
Capacitance
0.22µF
Tolerance
±10%
Package / Case
0603 (1608 Metric) Wide, 0306 (0816 Metric)
Voltage - Rated
10V
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Low ESL
Applications
General Purpose
Size / Dimension
0.032" L x 0.063" W (0.80mm x 1.60mm)
Thickness
0.50mm
Voltage Rating
10 Volts
Operating Temperature Range
- 55 C to + 85 C
Temperature Coefficient / Code
X5R
Product
General Type MLCCs
Dimensions
1.6 mm W x 0.8 mm L x 0.5 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-1802-2
C0816X5R1A224KT
C0816X5R1A224KT
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Flipped Type // Version A11
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix 1,2
General
Specifications
Copper ( thickness 0.035mm )
Solder resist
c
Solder Resist
P.C. Board for reliability test
Appendix - 1
100 mm
Copper
1.6mm
C Series — Low ESL Flipped Type
C0510
C0816
C1220
C1632
JIS
Case Code
Solder Resist
CC0204
CC0306
CC0508
CC0612
EIA
P.C. Board for bending test
Appendix - 2
100 mm
b
0.75
0.2
0.3
0.5
a
a
Dimensions (mm)
Copper
0.6
1.0
1.6
2.2
b
1.0
1.6
2.0
3.2
c