C3216X7R1E334K TDK Corporation, C3216X7R1E334K Datasheet - Page 60
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C3216X7R1E334K
Manufacturer Part Number
C3216X7R1E334K
Description
CAP CER .33UF 25V X7R 10% 1206
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(62 pages)
2.C1005X7R1E103K.pdf
(1 pages)
3.C0603C0G1E120J.pdf
(31 pages)
Specifications of C3216X7R1E334K
Capacitance
0.33µF
Voltage - Rated
25V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
0.85mm
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Voltage Rating
25VDC
Capacitor Case Style
1206
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-4018-2
C3216X7R1E334KT
C3216X7R1E334KT
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — General Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.25 - 0.35
0.25 - 0.35
[CC0603]
[CC0201]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.2 - 0.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C0603
C3216
Chip capacitor
A
0.35 - 0.45
[CC0805]
[CC0402]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1005
C3225
Solder land
[CC1206]
[CC0603]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
C1608
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC0805]
[CC2220]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C2012
Unit: mm
C5750
C Series — General Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling