12065C104KAT2A AVX Corporation, 12065C104KAT2A Datasheet - Page 18

• Manufacturer Part Number: 12065C104KAT2A
• Description: CAP CERM .1UF 10% 50V X7R 1206
• Manufacturer: AVX Corporation

Specifications of 12065C104KAT2A

• Capacitance: 0.1µF
• Package / Case: 1206 (3216 Metric)
• Voltage - Rated: 50V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Thickness: 0.94mm Max
• Tolerance (+ Or -): 10%
• Voltage: 50VDC
• Temp Coeff (dielectric): X7R
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 3.2mm
• Product Depth (mm): 1.6mm
• Product Height (mm): 0.94mm
• Product Diameter (mm): Not Requiredmm
• Dielectric Characteristic: X7R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 50VDC
• Capacitor Case Style: 1206
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Brand/series: 1206 Series
• Case Size: 1206
• Dielectric Strength: No breakdown or visual defects
• Dissipation Factor: 2.5 %
• Dissipation Factor, Test Condition: (Max.)
• Insulation Resistance: 100000 Megohms
• Length: 0.126 in. ±0.008 in.
• Material, Element: Ceramic
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Voltage, Rating: 50 VDC
• Width: 0.063 in. ±0.008 in.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: RoHS Compliant part
• Other names: 478-1556-2

Surface Mounting Guide
MLC Chip Capacitors
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of
board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the
MLC is located.
COMMON CAUSES OF
MECHANICAL CRACKING
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are con-
nected to the PCB. If the board is not supported during the
plug/unplug cycle, it may flex and cause damage to nearby
components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Preferred Method - No Direct Part Contact
No Stress Relief for MLCs
Solder Tip
REWORKING OF MLCs
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically impossi-
ble to cause any thermal shock in ceramic capacitors when
using hot air reflow.
However direct contact by the soldering iron tip often caus-
es thermal cracks that may fail at a later date. If rework by
soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300ºC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Routed Cut Line Relieves Stress on MLC
Poor Method - Direct Contact with Part
Solder Tip
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