08055C104KAT2A AVX Corporation, 08055C104KAT2A Datasheet - Page 18
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08055C104KAT2A
Manufacturer Part Number
08055C104KAT2A
Description
CAP CERM .1UF 10% 50V X7R 0805
Manufacturer
AVX Corporation
Series
08055Cr
Specifications of 08055C104KAT2A
Capacitance
0.1µF
Tolerance
±10%
Package / Case
0805 (2012 Metric)
Voltage - Rated
50V
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.94mm Max
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
1.25 mm W x 2.01 mm L
Termination Style
SMD/SMT
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Capacitor Case Style
0805
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Voltage Rating, Dc
50V
Capacitor Dielectric Type
CERAMIC MULTI-LAYER
Tolerance,
10%
Tolerance, -
10%
Temp, Op. Max
125(DEGREE
Brand/series
AVX
Case Size
0805
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
2.5 %
Dissipation Factor, Test Condition
(Max.)
Insulation Resistance
100000 Megohms
Length
0.079 in. ± 0.008 in.
Material, Element
Ceramic
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-55 °C
Termination
SMT
Voltage, Rating
50 VDC
Width
0.049 in. ± 0.008 in.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
478-1395-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
08055C104KAT2A
Manufacturer:
AVX
Quantity:
460 000
Part Number:
08055C104KAT2A
Manufacturer:
AVX
Quantity:
20 000
Surface Mounting Guide
MLC Chip Capacitors
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of
board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the
MLC is located.
COMMON CAUSES OF
MECHANICAL CRACKING
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are con-
nected to the PCB. If the board is not supported during the
plug/unplug cycle, it may flex and cause damage to nearby
components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Preferred Method - No Direct Part Contact
No Stress Relief for MLCs
Solder Tip
REWORKING OF MLCs
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically impossi-
ble to cause any thermal shock in ceramic capacitors when
using hot air reflow.
However direct contact by the soldering iron tip often caus-
es thermal cracks that may fail at a later date. If rework by
soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300ºC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Routed Cut Line Relieves Stress on MLC
Poor Method - Direct Contact with Part
Solder Tip
73