06035C333KAT2A AVX Corporation, 06035C333KAT2A Datasheet - Page 16
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06035C333KAT2A
Manufacturer Part Number
06035C333KAT2A
Description
CAP CER .033UF 10% 50V X7R 0603
Manufacturer
AVX Corporation
Specifications of 06035C333KAT2A
Capacitance
0.033µF
Package / Case
0603 (1608 Metric)
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.90mm Max
Tolerance (+ Or -)
10%
Voltage
50VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
1.6mm
Product Depth (mm)
0.81mm
Product Height (mm)
0.9mm
Product Diameter (mm)
Not Requiredmm
Brand/series
X7R Dielectric Series
Case Size
0603
Dielectric Characteristic
X7R
Dielectric Strength
No Breakdown or Visual Defects
Dissipation Factor
2.5 %
Dissipation Factor, Test Condition
(Max.)
Insulation Resistance
100000 Megohms
Length
0.063 in. ± 0.006 in.
Material, Element
Ceramic
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-55 °C
Termination
SMT
Voltage, Rating
50 VDC
Width
0.032 in. ± 0.006 in.
Capacitance Tolerance
± 10%
Voltage Rating
50V
Capacitor Case Style
0603
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
RoHS Compliant part
Other names
478-1233-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
06035C333KAT2A
Manufacturer:
AVX
Quantity:
600 000
Part Number:
06035C333KAT2A
Manufacturer:
AVX
Quantity:
20 000
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Recommended Soldering Profiles
Lead-Free Reflow Profile
Termination Type
Nickel Barrier
300
250
200
150
100
50
0
0
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Reflow
300
250
200
150
100
50
0
(Minimize soldering time)
50
1min
Tin/Lead/Silver Temp. °C
Preheat
60/40/0
Solder
100
1min
150
10 sec. max
260 ± 5
Solder
220°C
250°C
to
200
Natural
Cooling
Immersion Time
Time (s)
Seconds
250
30 ± 1
300
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other para-
meters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
b) Resin color may darken slightly due to the increase in
c) Lead-free solder pastes do not allow the same self align-
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
temperature required for the new pastes.
Wave
300
250
200
150
100
50
0
(Preheat chips before soldering)
T/maximum 150°C
1 to 2 min
Preheat
T
3 sec. max
230°C
250°C
to
Natural
Cooling
71