GRM216R71H103KA01D Murata Electronics North America, GRM216R71H103KA01D Datasheet - Page 153
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GRM216R71H103KA01D
Manufacturer Part Number
GRM216R71H103KA01D
Description
CAP CER 10000PF 50V 10% X7R 0805
Manufacturer
Murata Electronics North America
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM216R71H103KA01D
Capacitance
10000pF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
490-1664-2
GRM40X7R103K050AD
GRM40X7R103K050AD
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM216R71H103KA01D
Manufacturer:
MURATA
Quantity:
804 000
Company:
Part Number:
GRM216R71H103KA01D
Manufacturer:
MURATA
Quantity:
8 680
Part Number:
GRM216R71H103KA01D 0805 X7R 103K 50V 17
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Solderability
(1) Test Method
Table 1
2. Board Bending Strength for Solder Fillet Height
(1) Test Method
(2) Test Samples
(3) Acceptance Criteria
Table 2
1
Characteristics
Subject the chip capacitor to the following conditions.
Then apply flux (an ethanol solution of 25% rosin) to the
chip and dip it in 230D eutectic solder for 2 seconds.
Conditions:
Expose prepared at room temperature (for 6 months and
12 months, respectively)
Prepared at high temperature (for 100 hours at 85D)
Prepared left at high humidity (for 100 hours under
90%RH to 95%RH at 40D)
Solder the chip capacitor to the test PCB with the amount
of solder paste necessary to achieve the fillet heights.
Then bend the PCB using the method illustrated and
measure capacitance.
GRM21: 5C/R7/F5 Characteristics T=0.6mm
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 2.
GRM21 for flow/reflow soldering
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
5C
R7
F5
Sample
Within T5% or T0.5pF, whichever is greater
Within T12.5%
Within T20%
Material : Glass Epoxy
45
: Copper Foil (0.35mm thick)
: Solder Resist
1.2
Change in Capacitance
100
45
Capacitor
4.0
Initial State
95 to 100%
Supporting
Base
95 to 100%
Prepared at Room Temperature
6 months
1.6
R230
Capacitance Meter
12 months
Solder Amount
(2) Test Samples
(3) Acceptance Criteria
(4) Results
95%
20 50
GRM21 : Products for flow/reflow soldering.
With a 60-power optical microscope, measure the surface
area of the outer electrode that is covered with solder.
Refer to Table 1.
Pressurize
Pressurizing
Speed: 1.0mm/sec.
Flexure
100 Hours at 85D
Prepared at High
Temperature for
90 to 95%
Note : The material of pressure application jig and
support is the quenched metal.
(hardness HB 183-255 or superhardness
HRA90 or more)
Continued on the following page.
Reference Data
Prepared at High Humidity
for 100 Hours at 90 to
Larger Fillet.
Fillet up to Chip
Thickness
95% RH and 40D
95%
(in mm)
151
C02E.pdf
10.12.20