TAJB106M006RNJ AVX Corporation, TAJB106M006RNJ Datasheet - Page 13

• Manufacturer Part Number: TAJB106M006RNJ
• Description: CAP TANTALUM 10UF 6.3V 20% SMD
• Manufacturer: AVX Corporation
• Series: TAJr
• Type: Moldedr

Specifications of TAJB106M006RNJ

• Capacitance: 10µF
• Tolerance: ±20%
• Package / Case: 1210 (3528 Metric)
• Voltage - Rated: 6.3V
• Esr (equivalent Series Resistance): 3.000 Ohm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Size / Dimension: 0.138" L x 0.110" W (3.50mm x 2.80mm)
• Height: 0.075" (1.90mm)
• Manufacturer Size Code: B
• Features: General Purpose
• Voltage Rating: 6.3 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Mfr Case Code: B Case
• Dimensions: 2.8 mm W x 3.5 mm L x 1.9 mm H
• Product: Tantalum Solid Standard Grade - Other Various
• Termination Style: SMD/SMT
• Lead Spacing: 1.4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 478-3874-2; TAJB106M006R

Technical Summary and
Application Guidelines
2.1 RIPPLE RATINGS (A.C.)
In an a.c. application heat is generated within the capacitor
by both the a.c. component of the signal (which will depend
upon the signal form, amplitude and frequency), and by the
d.c. leakage. For practical purposes the second factor is
insignificant. The actual power dissipated in the capacitor is
calculated using the formula:
and
and substituting
where
Maximum a.c. ripple voltage (E
From the previous equation:
SECTION 2
A.C. OPERATION, RIPPLE VOLTAGE AND RIPPLE CURRENT
Case
size
TAJ/TPS/CWR11/THJ
I = rms ripple current, amperes
R = equivalent series resistance, ohms
E = rms ripple voltage, volts
P = power dissipated, watts
Z = impedance, ohms, at frequency under
W
A
B
C
D
R
S
Y
E
T
V
Series Molded Chip
rearranged to I =
consideration
dissipation (W)
Max. power
E
0.075
0.085
0.110
0.150
0.165
0.055
0.065
0.080
0.250
0.090
0.125
max
P =
P = E
max
= Z
).
Table I: Power Dissipation Ratings (In Free Air)
Z
I
2
2
2
R
R
(
(
P
P
⁄
⁄
R
R
) .....(Eq. 1)
)
.....(Eq. 2)
Series Molded Chip
Case
size
A
B
C
D
G
H
E
F
TAZ/CWR09
dissipation (W)
Max. power
0.050
0.070
0.075
0.080
0.090
0.100
0.125
0.150
Where P is the maximum permissible power dissipated as
listed for the product under consideration (see tables).
However care must be taken to ensure that:
1. The d.c. working voltage of the capacitor must not be
2. The sum of the applied d.c. bias voltage and the negative
Historical ripple calculations.
Previous ripple current and voltage values were calculated
using an empirically derived power dissipation required to
give a 10°C rise of the capacitors body temperature from
room temperature, usually in free air. These values are shown
in Table I. Equation 1 then allows the maximum ripple current
to be established, and Equation 2, the maximum ripple
voltage. But as has been shown in the AVX article on thermal
management by I. Salisbury, the thermal conductivity of a
Tantalum chip capacitor varies considerably depending upon
how it is mounted.
exceeded by the sum of the positive peak of the applied
a.c. voltage and the d.c. bias voltage.
peak of the a.c. voltage must not allow a voltage reversal
in excess of the “Reverse Voltage”.
Temperature correction factor
TAJ/TPS/CWR11/THJ
Temp. °C
Series Molded Chip
+125
+25
+55
+85
for ripple current
TAZ/CWR09
Factor
1.0
0.95
0.90
0.40
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