AU01ZC103KAG2A AVX Corporation, AU01ZC103KAG2A Datasheet - Page 6

• Manufacturer Part Number: AU01ZC103KAG2A
• Description: CAP CER 10000PF 10V X7RGOLD 0201
• Manufacturer: AVX Corporation
• Series: AUr

Specifications of AU01ZC103KAG2A

• Capacitance: 10000pF
• Voltage - Rated: 10V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Package / Case: 0201 (0603 Metric)
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MLCC Gold Termination – AU Series
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
(L) Length
(W) Width
(t) Terminal
* Contact factory
NOTE: Contact factory for non-specified capacitance values
Thickness
Cap
(pF)
Cap
(μF)
Letter
Max.
Packaging
Soldering
SIZE
SIZE
= Under Development
= *Optional Specifications – Contact factory
WVDC
WVDC
0.010
0.015
0.022
0.033
0.047
0.068
1000
1500
2200
3300
4700
6800
(0.013)
0.10
0.15
0.22
0.33
0.47
0.68
100
150
220
330
470
680
100
0.33
1.0
1.5
2.2
3.3
4.7
10
22
47
mm
mm
mm
(in.)
(in.)
(in.)
A
6.3 10 16 25
6.3 10 16 25
Reflow/Epoxy/
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
(0.024 ± 0.001)
(0.011 ± 0.001)
(0.006 ± 0.002)
Wire Bond*
0.60 ± 0.03
0.30 ± 0.03
0.15 ± 0.05
All Paper
(0.022)
AU01
AU01
A
A
A
A
A
A
A
A
A
A
A
A
A
0.56
C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
PAPER
(0.028)
0.71
C* C*
C* C* C*
C* C*
E*
4
4
E
6.3 10 16 25 50
6.3 10 16 25 50
C*
C
Reflow/Epoxy/
(0.040 ± 0.004)
(0.020 ± 0.004)
(0.010 ± 0.006)
Wire Bond*
1.00 ± 0.10
0.50 ± 0.10
0.25 ± 0.15
All Paper
C
AU02
AU02
(0.035)
0.90
C
C
C
C
C
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
(0.037)
0.94
G* G* J*
K* J*
J
J* J* J*
J* J* J*
4 6.3 10
4 6.3 10
G G
Reflow/Epoxy/
(0.063 ± 0.006)
(0.032 ± 0.006)
(0.014 ± 0.006)
Wire Bond*
All Paper
1.60 ± 0.15
0.81 ± 0.15
0.35 ± 0.15
(0.040)
AU03
AU03
1.02
K
16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
G
G
G
G
G
J*
J*
G
G
G
G
G
G
G
G
G
J*
(0.050)
G
G
G
G
1.27
M
G
G
G
G
G
G
G
G
G
P* P* P*
P*
N
N
N
N
N
Paper/Embossed
(0.055)
Reflow/Epoxy/
1.40
(0.079 ± 0.008)
(0.049 ± 0.008)
(0.020 ± 0.010)
N N
N N
N
N N* N*
*
Wire Bond*
N
2.01 ± 0.20
1.25 ± 0.20
0.50 ± 0.25
AU05
AU05
N
N
N
N
N
N
N
N
*
(0.060)
1.52
N
N
EMBOSSED
P
P*
N
N
N
N
N
Q* Q* Q*
Q*
Q
Q
Q
(0.070)
Paper/Embossed
1.78
Reflow/Epoxy/
Q
Q
Q
Q
(0.126 ± 0.008)
(0.063 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
3.20 ± 0.20
1.60 ± 0.20
0.50 ± 0.25
AU06
AU06
Q
Q
Q
Q*
Q
Q
Q
Q
(0.090)
2.29
X
Q
Q
Q
L
Z*
(0.100)
4 6.3 10
4 6.3 10
2.54
Y
Z*
Z*
Z
t
Paper/Embossed
Reflow/Epoxy/
(0.126 ± 0.008)
(0.098 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
X
Z
3.20 ± 0.20
2.50 ± 0.20
0.50 ± 0.25
AU10
AU10
(0.110)
16 25 35 50 6.3 10 25 50
16 25 35 50 6.3 10 25 50
Q
Z
Z
2.79
Z
W
X
Z
Z
Z
Z
X
X
T
X
X
AU12
AU12
Z
35