CA3039 Intersil, CA3039 Datasheet - Page 2

• Manufacturer Part Number: CA3039
• Description: DIODE ARRAY- 6 MATCH. UF,LOW CAP
• Manufacturer: Intersil

Specifications of CA3039

• Rohs Status: RoHS non-compliant

Absolute Maximum Ratings
Inverse Voltage (PIV) for: D
Diode-to-Substrate Voltage (V
DC Forward Current (I
Recurrent Forward Current (I F ) . . . . . . . . . . . . . . . . . . . . . . . 100mA
Forward Surge Current (I F
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . -55
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
NOTE:
(Terminal 1, 4, 5, 8 or 12 to Terminal 10)
DC Forward Voltage Drop (Figure 1)
DC Reverse Breakdown Voltage
DC Reverse Breakdown Voltage Between Any
Diode Unit and Substrate
DC Reverse (Leakage) Current (Figure 2)
DC Reverse (Leakage) Current Between Any
Diode Unit and Substrate (Figure 3)
Magnitude of Diode Offset Voltage (Note 2)
(Figure 1)
Temperature Coefficient of |V
Temperature Coefficient of Forward Drop
(Figure 5)
DC Forward Voltage Drop for Anode-to-
Substrate Diode (D
Reverse Recovery Time
Diode Resistance (Figure 6)
Diode Capacitance (Figure 7)
Diode-to-Substrate Capacitance (Figure 8)
1.
2. Magnitude of Diode Offset Voltage is the difference in DC Forward Voltage Drops of any two diode units.
JA
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
S
)
F
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25mA
(SURGE)
1
- D
DI
F1
D
) for D
5
6
- V
. . . . . . . . . . . . . . . . . . . . . . . . 5V
. . . . . . . . . . . . . . . . . . . . . . . 0.5V
). . . . . . . . . . . . . . . . . . . . 100mA
T
F2
A
1
= 25
| (Figure 4)
- D
5
o
C; Characteristics apply for each diode unit, Unless Otherwise Specified
. . . . . . . . . . . .20V, -1V
--------------------------------- -
o
V
SYMBOL
C to 125
V
F1
V
V
F1
---------- -
(BR)R
(BR)R
t RR
C
R
C
V
V
I
I
–
V
R
R
DI
T
T
F
–
F
D
D
F
V
V
CA3039
F2
F2
o
C
2
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Power Dissipation (Any One Diode) . . . . . . . . . . . 100mW
Maximum Junction Temperature (Metal Can Package) . . . . . . . 175
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
I
I
I
I
I
I
V
V
I
I
I
I
I
f = 1kHz, I
V
V
F
F
F
F
R
R
F
F
F
F
F
Metal Can Package . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
R
R
R
DI
TEST CONDITIONS
= 50 A
= 1mA
= 3mA
= 10mA
= 1mA
= 1mA
= 1mA
= 1mA
= 10mA, I
= -10 A
= -10 A
= -4V
= -10V
= -2V, I
= 4V, I
F
F
F
= 1mA
R
= 0
= 0
= -10mA
MIN
20
25
5
-
-
-
-
-
-
-
-
-
-
-
-
-
0.016
0.022
TYP
0.65
0.73
0.76
0.81
0.65
0.65
-1.9
0.5
1.0
1.0
3.2
30
7
-
JA
200
220
(
o
C/W)
MAX
0.69
0.78
0.80
0.90
100
100
5.0
45
-
-
-
-
-
-
-
-
o
C to 150
JC
UNITS
mV/
120
N/A
(
mV
V/
o
nA
nA
ns
pF
pF
V
V
V
V
V
V
V
C/W)
o
o
C
C
o
o
o
o
C
C
C
C