ACASA1001E2001P1AT Vishay, ACASA1001E2001P1AT Datasheet - Page 7
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ACASA1001E2001P1AT
Manufacturer Part Number
ACASA1001E2001P1AT
Description
RES ARRAY 1.0K/2.0K OHM 4RES SMD
Manufacturer
Vishay
Series
ACA - Automotiver
Datasheet
1.ACASA4702E4702P1AT.pdf
(8 pages)
Specifications of ACASA1001E2001P1AT
Resistance (ohms)
1K, 2K
Number Of Resistors
4
Circuit Type
Isolated
Temperature Coefficient
±25ppm/°C
Tolerance
±0.25%
Power Per Element
125mW
Number Of Pins
8
Package / Case
1205 (3215 Metric), Convex
Size / Dimension
0.126" L x 0.059" W (3.20mm x 1.50mm)
Height
0.018" (0.45mm)
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Product Type
Arrays
Resistance
1 KOhms, 2 KOhms
Power Rating
0.3 Watt
Dimensions
3.2 mm W x 1.5 mm L x 0.45 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ACASA-1.0K/2.0K-EATTR
ACASA1001E2001P1AT
ACASA1001E2001P1AT
www.vishay.com
282
ACAS 0606 AT, ACAS 0612 AT - Precision
Vishay Beyschlag
Notes
(1)
(2)
(3)
(4)
TEST PROCEDURES AND REQUIREMENTS
CLAUSE
4.24
4.39
4.13
4.40
4.19
4.18.2
4.17.2
4.32
4.33
4.35
4.22
4.7
60115-1
The quoted IEC standards are also released as EN standards with the same number and identical contents
Figures are given for arrays with equal values, design type AE
Relative values are equivalent to the half of its value with ± symbol, i.e. 0.1 % is equivalent to ± 0.05 %
For a single element
EN
60068-2
METHOD
78 (Cab)
21 (Ue
21 (Ue
14 (Na)
67 (Cy)
58 (Td)
58 (Td)
6 (Fc)
TEST
IEC
-
-
-
-
3
1
(1)
)
)
(Human body model)
Resistance to soldering
Electrostatic discharge
Short time overload
Substrate bending
Shear (adhesion)
Rapid change of
Voltage proof
steady state,
Flammability
Solderability
steady state
temperature
Damp heat,
Damp heat,
accelerated
Vibration
TEST
heat
For technical questions, contact:
Precision Thin Film Chip Resistor Array
(4)
(4)
Superior Moisture Resistivity
Stability for product types:
10 to 2000 Hz; no resonance;
accelerated aging 4 h/155 °C
accelerated aging 4 h/155 °C
(equivalent to MIL-STD-883,
SnAgCu; non-activated flux
(IR/forced gas convention);
between adjacent resistors
60 ± 5 s; against ambient,
Endurance by sweeping;
SnPb; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
needle flame test; 10 s
Method 3015); 1000 V
amplitude ≤ 1.5 mm or
U = 2.5 x
30 min at - 55 °C and
(40 ± 2) °C; 56 days;
Depth 2 mm, 3 times
Solder bath method;
Solder bath method;
U = 0.1 x
30 min at 125 °C;
Reflow method 2
IEC 60695-11-5,
IEC 61340-3-1;
3 pos. + 3 neg.
≤ 200 m/s
PROCEDURE
(93 ± 3) % RH
(85 ± 5) % RH
U = 2 x U
(260 ± 5) °C;
1000 cycles
U
(85 ± 2) °C
(10 ± 1) s
≤ 100 V;
rms
1000 h
45 N
5 s
ACAS 0606 AT
ACAS 0612 AT
= U
P
P
thinfilmarray@vishay.com
70
2
max.
70
; 6 h
ins
x R
x R
;
or
PERMISSIBLE CHANGE (ΔR)
Good tinning (≥ 95 % covered);
no open circuit in bent position
No flashover or breakdown
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω);
No burning after 30 s
REQUIREMENTS
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
No visible damage
no visible damage;
no visible damage
no visible damage
no visible damage
no visible damage
no visible damage
47 Ω to 150 kΩ
47 Ω to 150 kΩ
Document Number: 28770
Revision: 06-Nov-09
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