TLP598G Toshiba, TLP598G Datasheet - Page 21

• Manufacturer Part Number: TLP598G
• Description: PHOTOCOUPLER RELAY SSR 6-DIP
• Manufacturer: Toshiba
• Series: TLP598Gr

Specifications of TLP598G

• Circuit: SPST-NO (1 Form A)
• Output Type: AC, DC
• On-state Resistance: 12 Ohm
• Load Current: 150mA
• Voltage - Input: 1.4VDC
• Voltage - Load: 0 ~ 400 V
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Package / Case: 6-DIP (0.300", 7.62mm)
• Input Type: DC
• Input Voltage (max): 1.7V
• Output Voltage (max): 400V
• Input Current (max): 30mA
• Output Current: 150mA
• Isolation Voltage: 2.5kV
• Circuit Arrangement: 1 Form A
• Package Type: PDIP
• Output Device: MOSFET
• Pin Count: 5
• Mounting: Through Hole
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Rad Hardened: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP2105
TLP2108
TLP2200
TLP109
TLP2409
TLP512
TLP550
TLP551
TLP2403
TLP553
TLP559
TLP651
TLP719
TLP719F
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
2
5
2
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
4
3
3
4
4
3
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
SO6 (reinforced insulation)
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
DIP6
6-pin package version
of the TLP550
DIP8
High CMR
DIP8
Internal base connection
SO8
Low input current
SO8 version of the TLP553
DIP8
Low input drive current
DIP8
High CMR version
of the TLP550
DIP8
Internal base connection
SDIP6
High CMR
SO8
Dual-channel version for
the TLP105
V
SO8
Dual-channel version for
the TLP108
V
DIP8
Low input current
V
CC
CC
CC
= 4.5 to 20 V
= 4.5 to 20 V
= 4.5 to 20 V
Features
Features
: Approved (reinforced insulation)
(NRZ) (Typ.)
Propagation
Delay Time
Data Rate
300 kbit/s
300 kbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
250 ns
250 ns
400 ns
(Max)
21
(19% min for rank 0)
(19% min for rank 0)
(19% min for rank 0)
(Inverter logic)
(Buffer logic)
(Buffer logic)
Output Form
Totem pole
Totem pole
400%
400%
20% (min)
20%
20%
20%
10%
10%
10%
20%
3-state
output
output
CTR
: Design which meets safety standard/approval pending as of January 2011
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
1.6 mA
1.6 mA
1.6 mA
0.5 mA
16 mA
16 mA
0.5 mA
16 mA
16 mA
16 mA
16 mA
16 mA
16 mA
(Max)
I
I
@I
FHL
FLH
F
,
Vrms
Vrms
Vrms
Vrms
Vrms
3750
3750
2500
3750
Vrms
3750
2500
Vrms
2500
Vrms
2500
Vrms
3750
2500
Vrms
2500
Vrms
5000
Vrms
5000
Vrms
BVs
BVs
UL/cUL TÜV
UL/cUL TÜV
/
/
/
/
/
/
/
/
/
/
/ –
/
/ –
Safety Standards
Safety Standards
VDE
VDE
(1)
(1)
(1)
(1)
(1)
BSI
BSI
(2)
(2)
IEC
IEC