TLP227G-2(TP1,N,F) Toshiba, TLP227G-2(TP1,N,F) Datasheet - Page 42

• Manufacturer Part Number: TLP227G-2(TP1,N,F)
• Description: PHOTOCOUPLER RELAY SSR 8-SMD
• Manufacturer: Toshiba
• Series: TLP227G-2r

Specifications of TLP227G-2(TP1,N,F)

• Circuit: DPST (2 Form A)
• Output Type: AC, DC
• On-state Resistance: 35 Ohm
• Load Current: 120mA
• Voltage - Input: 1.15VDC
• Voltage - Load: 0 ~ 350 V
• Mounting Type: Surface Mount
• Termination Style: Gull Wing
• Package / Case: 8-SMD (300 mil)
• Load Voltage Rating: 350 V
• Load Current Rating: 0.1 A
• Contact Form: 2 Form A
• Output Device: MOSFET
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP227G2NFTR

6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
–
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
–
4
(TP4)
(LF4)
9
8
Min
8.0
–
(0.25 typ.)
B
(LF4)
Max
12.0
–
Min
6.4
–
–
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
–
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16