CPC1916Y Clare, CPC1916Y Datasheet - Page 5

RELAY OPTOMOS SP-NO 2.5A 4-SIP

CPC1916Y

Manufacturer Part Number
CPC1916Y
Description
RELAY OPTOMOS SP-NO 2.5A 4-SIP
Manufacturer
Clare
Series
CPC, OptoMOS®r
Datasheet

Specifications of CPC1916Y

Circuit
SPST-NO (1 Form A)
Output Type
AC, DC
On-state Resistance
340 mOhm
Load Current
2.5A
Voltage - Input
1.2VDC
Voltage - Load
0 ~ 100 V
Mounting Type
Through Hole
Termination Style
PC Pin
Package / Case
4-SIP
Input Type
DC
Input Voltage (max)
1.4V
Output Voltage (max)
100V
Input Current (max)
50mA
Output Current
2.5A
Circuit Arrangement
1 Form A
Output Device
MOSFET
Pin Count
4
Mounting
Through Hole
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Rad Hardened
No
Load Voltage Rating
60 V
Load Current Rating
2 A
Relay Type
Single Pole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
CLA209
CPC1916Y
Manufacturing Information
Moisture Sensitivity
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
ESD Sensitivity
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
should not be used.
R05
Pb
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
2002/95/EC
RoHS
e
3
CPC1916Y
CPC1916Y
Device
Device
www.clare.com
Moisture Sensitivity Level (MSL) Rating
Maximum Temperature x Time
245ºC for 30 seconds
MSL 1
CPC1916
5

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