AD9742ACP-PCB Analog Devices Inc, AD9742ACP-PCB Datasheet - Page 30

no-image

AD9742ACP-PCB

Manufacturer Part Number
AD9742ACP-PCB
Description
BOARD EVAL FOR AD9742ACP
Manufacturer
Analog Devices Inc
Series
TxDAC®r
Datasheet

Specifications of AD9742ACP-PCB

Rohs Status
RoHS non-compliant
Number Of Dac's
1
Number Of Bits
12
Outputs And Type
1, Differential
Sampling Rate (per Second)
210M
Data Interface
Parallel
Settling Time
11ns
Dac Type
Current
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9742
AD9742
ORDERING GUIDE
Models
AD9742AR
AD9742ARRL
AD9742ARZ
AD9742ARZRL
AD9742ARU
AD9742ARURL7
AD9742ARUZ
AD9742ARUZRL7
AD9742ACP
AD9742ACPRL7
AD9742ACPZ
AD9742ACPZRL7
AD9742-EB
AD9742ACP-PCB
1
2
R = Small Outline IC; RU = Thin Shrink Small Outline Package; CP = Lead Frame Chip Scale Package.
Z = Pb-free part.
2
2
2
2
2
2
1.00
0.85
0.80
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
12° MAX
SEATING
PLANE
BSC SQ
PIN 1
INDICATOR
VIEW
5.00
TOP
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP]
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Dimensions shown in millimeters
BSC SQ
0.20 REF
5 mm × 5 mm Body (CP-32-2)
4.75
Rev. B | Page 30 of 32
0.05 MAX
0.02 NOM
Package Description
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
Evaluation Board (SOIC)
Evaluation Board (LFCSP)
0.60 MAX
COPLANARITY
BSC
0.50
0.50
0.40
0.30
0.08
17
24
16
25
0.60 MAX
BOTTOM
VIEW
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.25 MIN
Package Options
R-28
R-28
R-28
R-28
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
CP-32-2
1

Related parts for AD9742ACP-PCB