NBSG111BAEVB ON Semiconductor, NBSG111BAEVB Datasheet - Page 11

BOARD EVALUATION BBG NBSG111BA

NBSG111BAEVB

Manufacturer Part Number
NBSG111BAEVB
Description
BOARD EVALUATION BBG NBSG111BA
Manufacturer
ON Semiconductor
Datasheets

Specifications of NBSG111BAEVB

Main Purpose
Clock/Data Driver
Utilized Ic / Part
NBSG111
Primary Attributes
W/RSECL Outputs
Technology Type
Evaluation Board
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
NBSG111
Other names
NBSG111BAEVB
NBSG111BAEVBOS
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
4 X
0.15
B
E1
A
C
E
e
É É
É É
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
7
TERMINAL A1 CORNER
6
VIEW Z−Z
5
PLASTIC 8x8 mm (1.0 mm pitch) BGA FLIP CHIP PACKAGE
D1
D
4
3
e
2
1
A
B
C
D
E
F
G
DETAIL A
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
49 X
http://onsemi.com
CASE 489A−02
BA SUFFIX
FCBGA−49
b
0.15
0.08
ISSUE A
A2
NOTE 3
11
M
M
C
C
A
A
B
Z
Z
SEATING
PLANE
NOTE 4
49 X
0.12 C
C
NOTE 5
NOTES:
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM C (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
6. 489A-01 OBSOLETE, NEW STANDARD 489A-02.
0.20 C
Y14.5M-1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE C.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
(ROTATED 90
DIM
A1
A2
D1
E1
A
D
b
E
e
DETAIL A
MILLIMETERS
MIN
0.40
---
0.3
0.91 REF
8.00 BSC
6.00 BSC
8.00 BSC
6.00 BSC
1.00 BSC
_
MAX
A1
1.40
0.60
0.5
C.W.)
NBSG111/D

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