ATAVRDRAGON Atmel, ATAVRDRAGON Datasheet - Page 64

• Manufacturer Part Number: ATAVRDRAGON
• Description: KIT DRAGON 32KB FLASH MEM AVR
• Manufacturer: Atmel
• Series: AVR Dragon™r
• Type: AVR® In-Systemr

Specifications of ATAVRDRAGON

• Contents: Programmer/Debugger
• Architecture: 8-bit RISC
• Positions/sockets: 1
• Description/function: RISC AVR Emulator and Progammer
• Core Architecture: AVR
• Core Sub-architecture: MegaAVR
• Ic Product Type: Debugger
• Features: High Voltage Serial Programming, Parallel Programming, Supports Up To 32 Software Breakpoints
• Connector Type A: USB
• Rohs Compliant: Yes
• For Use With/related Products: Atmega128, 168, 32, 48, 8, 88, ATtiny13, 2313, 24, 25, 45, 85
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

N
Serial Flash Memory
DataFlash
Uniform Block Erase Serial Flash
Notes:
Part Number
Page-erase, Byte-alterable, 2.7 to 3.6V – Industrial Temperature Grades
AT45DB011D
AT45DB021D
AT45DB041D
AT45DB081D
AT45DB161D
AT45DB321D
AT45DB642D
Page-erase, Byte-alterable, Low Battery Voltage, 2.5 to 3.6V – Industrial Temperature Grades
AT45DB041D-2.5 4-Mbit
AT45DB081D-2.5 8-Mbit
AT45DB161D-2.5 16-Mbit
DataFlash Cards
Page-erase, Byte-alterable, 2.7 to 3.6V – Industrial Temperature Grades
AT45DCB002D
AT45DCB004D
AT45DCB008D
Part Number
Uniform Block Erase Serial Flash, 2.7 to 3.6 – Industrial Temperature Grades
AT25F512A
AT25F512B
AT25FS010
AT25F2048
AT25DF021
AT25DF041A
AT26DF081A
AT25DF081
AT26DF161A
AT25DF161
AT25DF321
AT25DF321A
AT25DF641
ONVOLATILE
1.
2.
Package Designator:
MW –
8MW, 8-pad, 6 x 8 mm (MLF/VDFN) (Footprint Compatible to 8-pin EIAJ SOIC); 8MW1, 8-pad, 6 x 8 x 1.0 mm Very Thin Dual (VDFN).
mended for New Designs).
lead, 8 x 13.4 mm.
Green (RoHS Compliance)
Density
Winter 2008
(Mbits)
2-Mbyte 2.7
4-Mbyte 2.7
8-Mbyte 2.7
Density
®
16-Mbit
32-Mbit
64-Mbit
(Mbits)
0.5
0.5
1-Mbit
2-Mbit
4-Mbit
8-Mbit
16
16
32
32
64
8
1
2
2
4
8
MLF/UDFN/VDFN: 8M1-A, 8-pad, 5 x 6 x 1.0 mm (Footprint Compatible to 8-pin SOIC, JEDEC); 8MA1, 8-pad 5 x 6 x 0.6 mm (UDFN); 8MA3, 8-pad, 2 x 3 x 0.6 mm (UDFN/USON);
Page Erase Serial Flash
Min (V) Interface Architecture
2.7/2.3
Min (V)
VCC
1.65
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.7
M
VCC
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.5
2.5
2.5
11U1 –
EMORY
C –
Serial (SPI Bus)/Dual I/O 100
Serial (SPI Bus)/Dual I/O 100
Serial (SPI Bus)/Dual I/O 100
Dual/SPI/Rapid8
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
CBGA: 9C1, 9-ball, 5 x 5 x 1.2 mm; 24C1, 24-ball, 6 x 8 x 1.4 mm.
Architecture
SS – SOIC
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
Serial (SPI Bus)
WLCSP, 11-ball.
Serial (SPI Bus
Interface
Packaging Available for All Serial Flash Memory Products.
(C
(Narrow): 8S1, 8-lead, 0.150” Wide.
®
ONTINUED
Y7 –
Speed
(MHz)
66/50 2 (1024/1056 Bytes Each) Individual Sector
66
66
66
66
66
66
50
50
50
66
66
66
UTSAP: 8Y7, 8-lead, 6 x 4.90 mm Body.
Speed
(MHz)
33
70
50
33
70
70
70
66
70
70
2 (256/264 Bytes Each)
2 (256/264 Bytes Each)
2 (512/528 Bytes Each)
2 (512/528 Bytes Each)
2 (256/264 Bytes Each)
2 (256/264 Bytes Each)
2 (512/528 Bytes Each)
2 (1056 Bytes Each)
2 (528 Bytes Each)
2 (528 Bytes Each)
1 (256/264 Bytes)
1 (256/264 Bytes)
Min Erase
SRAM/Buffers
(Kbytes)
32
64
4
4
4
4
4
4
4
4
4
4
4
)
S –
1/32, 1/16, 1/8, 1/4,
1/4, 1/2, Full Array
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
SOIC: 8S2, 8-lead, 0.208 Wide.
1/2, Full Array
Protection
Full Array
Full Array
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Individual Sector
Protection
7DF1 –
CN –
CASON: 8CN3, 8-pad, 6 x 8 mm (Footprint Compatible with 8-pin SOIC, EIAJ). M, MA,
7-pad, 2.5 mm Pitch, 24 x 32 x 1.4 mm Body DataFlash Card.
Lockdown
Sector
Lockdown
Sector
x
x
x
S3 –
x
x
x
x
x
x
x
x
x
x
x
x
x
SOIC: 16S, 16-lead, 0.300” Wide Body.
Number
Serial
Number
x
x
x
x
x
Serial
www.atmel.com
x
x
x
x
x
x
x
x
x
x
x
x
x
Bit I/O
Dual
R –
x
x
x
S(8S2)-MW(8MW)-M(8M1-A)-
S(8S2)-SS(8S1)-M(8M1-A)
S(8S2)-SS(8S1)-M(8M1-A)
S(8S2)-SS(8S1)-M(8M1-A)
S(8S2)-SS(8S1)-M(8M1-A)
S(8S2)-SS(8S1)-M(8MA1)
S(8S2)-SS(8S1)-M(8MA1)
S(8S2)-M(8M1-A)-T(28T)-
SOIC: 28R, 28-lead, 0.330 Wide (Not Recom-
S(8S2)-M(8M1-A)-T(28T)
SS(8S1)-M(8MA1)-U(11U1)
S(8S2)-SS(8S1)-M(8M1-A)
S(8S2)-SS(8S1)-M(8MA1)
S(8S2)-SS(8S1)-M(8MA1)
S(8S2)-S3(16S)-M(8MA1)
CN(8CN3)-T(28T)
T(28T)-C(24C1)
SS(8S1)-MA(8MA3)
MW(8MW)-S3(16S)
SS(8S1)-M(8MA1)
SS(8S1)-Y4(8Y4)
SS(8S1)-Y7(8Y7)
SS(8S1)-Y7(8Y7)
Packages
S(8S2)-SS(8S1)
S(8S2)-S3(16S)
C(24C1)
Packages
7DF1
7DF1
7DF1
T – TSOP
(Type 1): 28T, 28-
Availability
Availability
4Q2008
1Q2009
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
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