EDK3687 Renesas Electronics America, EDK3687 Datasheet - Page 3

• Manufacturer Part Number: EDK3687
• Description: DEV EVALUATION KIT H8/3687
• Manufacturer: Renesas Electronics America
• Series: H8®r
• Type: MCUr

Specifications of EDK3687

• Contents: 2G (Second-generation) Evaluation Board, HEW debugger support, Cable and CD-ROM
• For Use With/related Products: H8/3687
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK)........................................................................... 4
2.2. SERIAL CONNECTION ....................................................................................................................................... 4
2.3. POWER SUPPLY ................................................................................................................................................ 4
3.1. EDK BLOCK DIAGRAM....................................................................................................................................... 5
4.1. USER INTERFACE.............................................................................................................................................. 6
4.2. SERIAL INTERFACE........................................................................................................................................... 6
4.3. SPI EEPROM....................................................................................................................................................... 7
4.4. I2C EEPROM....................................................................................................................................................... 8
4.5. LIN INTERFACE .................................................................................................................................................. 8
4.6. LEDS.................................................................................................................................................................... 8
5.1. JUMPER LINKS................................................................................................................................................... 9
5.2. EDK OPTIONS – CJ4 ........................................................................................................................................ 10
5.3. OPTION LINK SELECTION............................................................................................................................... 11
5.4. FLASH PROGRAMMING HEADER .................................................................................................................. 12
5.5. EXTERNAL DEBUG HEADER .......................................................................................................................... 12
5.6. BOOT CONTROL .............................................................................................................................................. 12
6.1. HEADER J1 ....................................................................................................................................................... 13
6.2. HEADER J2 ....................................................................................................................................................... 13
7.1. HMON ................................................................................................................................................................ 14
7.2. ADDITIONAL INFORMATION ........................................................................................................................... 16
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........................................................................................................................................... 14
............................................................................................................................................ 5
EADER
....................................................................................................................................... 4
C
ONNECTIONS
......................................................................................................... 13
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