EDOSK2674 Renesas Electronics America, EDOSK2674 Datasheet - Page 3

DEV EVALUATION KIT H8S/2674

EDOSK2674

Manufacturer Part Number
EDOSK2674
Description
DEV EVALUATION KIT H8S/2674
Manufacturer
Renesas Electronics America
Series
H8®r
Type
MCUr
Datasheet

Specifications of EDOSK2674

Contents
EDOSK (Evaluation Development Operating System Kit) Board
For Use With/related Products
H8S/2674R
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
1.1. EDOSK2674 GENERAL BOARD LAYOUT.......................................................................................................... 5
1.2. EDOSK2674 ACTUAL BOARD LAYOUT............................................................................................................. 6
2.1. POWER SUPPLY................................................................................................................................................. 7
2.2. OPERATING MODES .......................................................................................................................................... 7
2.3. H8/2674R MICROCOMPUTER............................................................................................................................ 8
2.4. BOOT FLASH MEMORY...................................................................................................................................... 8
2.5. MAIN FLASH MEMORY....................................................................................................................................... 9
2.6. RAM ..................................................................................................................................................................... 9
2.7. SDRAM................................................................................................................................................................. 9
2.8. LAN CONTROLLER............................................................................................................................................. 9
2.9. REAL TIME CLOCK ........................................................................................................................................... 10
2.10. SWITCHES......................................................................................................................................................... 10
2.11. INDICATORS ..................................................................................................................................................... 10
3.1. SERIAL INTERFACE ......................................................................................................................................... 11
3.2. LAN INTERFACE ............................................................................................................................................... 12
3.3. EXPANSION CONNECTOR .............................................................................................................................. 13
3.4. AUXILIARY I/O HEADER................................................................................................................................... 14
4.1. JUMPER LINKS ................................................................................................................................................. 16
4.2. RTC BACKUP SUPPLY ..................................................................................................................................... 16
4.3. REMOTE SWITCH............................................................................................................................................. 17
4.4. CRYSTAL CHOICE............................................................................................................................................ 17
4.5. REMOVABLE COMPONENT INFORMATION................................................................................................... 18
4.6. ADDITIONAL COMPONENT INFORMATION. .................................................................................................. 18
6.1. FLASH PROGRAMMING................................................................................................................................... 20
6.2. TEST MENU....................................................................................................................................................... 20
6.3. HDI-MONITOR ................................................................................................................................................... 20
7.1. EDOSK2674 MEMORY MAP............................................................................................................................. 21
7.2. H8/2674R REGISTER CONFIGURATION......................................................................................................... 23
9.1. MECHANICAL.................................................................................................................................................... 34
T
1.
2.
3.
4.
5.
6.
7.
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9.
ABLE OF
I
EDOSK2674 B
E
B
S
C
S
M
D
NTRODUCTION
XTERNAL
TART
OFTWARE
OARD
ODE
ESIGNING AN
ECHANICAL
C
ONTENTS
D
-
UP
O
EVELOPMENT
PTIONS
I
I
NSTRUCTIONS
........................................................................................................................................................... 21
NTERFACES
D
E
....................................................................................................................................................... 3
....................................................................................................................................................... 5
RAWING
LOCK
XPANSION
.................................................................................................................................................. 16
........................................................................................................................................... 20
D
IAGRAM
........................................................................................................................................ 11
........................................................................................................................................ 33
...................................................................................................................................... 19
C
ARD
.............................................................................................................................. 7
.......................................................................................................................... 34
Table of Contents
3

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