3DK38124 Renesas Electronics America, 3DK38124 Datasheet
3DK38124
Specifications of 3DK38124
Related parts for 3DK38124
3DK38124 Summary of contents
Page 1
... U M SER F H8/38124 ICROCONTROLLER Check the silkscreen around the power jack (J9) for the minimum and maximum voltage input levels for this 3DK. Always use a centre positive supply for this board. DO NOT USE AN E6000 POWER SUPPLY with this 3DK ANUAL - N CHIP ...
Page 2
Preface Cautions 1. This document may be, wholly or partially, subject to change without notice. 2. All rights reserved. No one is permitted to reproduce or duplicate, in any form, a part or this entire document without Renesas Technology Europe ...
Page 3
T C ABLE OF ONTENTS T C .......................................................................................................................................................3 ABLE OF ONTENTS ..........................................................................................................................................4 OWER EQUIREMENTS 2. P – ........................................................................................................................................4 OWER P EHAVIOUR 3. P ...............................................................................................................................................................4 URPOSE ......................................................................................................................................................4 OARD AYOUT ....................................................................................................................................................6 ...
Page 4
P R OWER EQUIREMENTS All 3DK boards are centre positive with a 2.5mm barrel power jack. The diode, D1 provides reverse polarity protection. A 9V, centre positive supply is suitable for use with this board. Warning Check the silkscreen ...
Page 5
The following diagram shows the component layout bottom layer component of the board. Note: The diagram below is for illustrative purposes and does not accurately reflect the 3DK detailed in this manual. BOOT LATCH U2 HC74 dual D-type logic PCB ...
Page 6
B D LOCK IAGRAM Diagram 5.1 is representative of the 3DK components and their connectivity. Power Jack & Regulator IC Generic Headers Flash/Boot Header Micon Headers Serial Connector Debug Header SER IRCUITRY 6.1. S WITCHES There ...
Page 7
S ERIAL PORT The microcontroller programming serial port (SCI3) is connected to the D–type connector J8 via an RS232 transceiver. The serial baud rates supported by this 3DK are shown below. Note: these values are calculated from the frequency ...
Page 8
O S SCILLATOR OURCES A crystal resonator is fitted on the 3DK and used to supply the main clock input to the Renesas microcontroller. Table 7-1 details the oscillators that are fitted on this 3DK: Component Yes Crystal Yes ...
Page 9
BOOT P ROGRAMMING The microcontroller must enter boot mode for programming, and the programming port must be connected to a host for program download. To execute the boot transition, and allow programs to download to the microcontroller, the user ...
Page 10
J3 Circuit Net Name Pin CON_PIN57 (PIN57 via a 0R link Circuit Net Name Pin 10.2. G ...
Page 11
Connected via a DNF 0R Link, refer to schematic for further details. 11 ODE EVELOPMENT 11.1. O VERVIEW Note: For all code debugging using Renesas software tools, the 3DK board must be connected serial ...
Page 12
M M EMORY AP The memory map shown in this section visually describes the locations of program code sections related to HMON, the FDT kernels and the supporting code within the ROM/RAM memory areas of the microcontroller. H'0000 Vectors ...
Page 13
AUD ATE ETTING HMON is initially set to connect at 38400 Baud. The value set in the baud rate register for the microcontroller must be altered if the user wishes to change either the serial communication ...