HMC5843-EVAL Honeywell Microelectronics & Precision Sensors, HMC5843-EVAL Datasheet - Page 4

• Manufacturer Part Number: HMC5843-EVAL
• Description: BOARD EVALUATION FOR HMC5843
• Manufacturer: Honeywell Microelectronics & Precision Sensors

Specifications of HMC5843-EVAL

• Sensor Type: Magnetic, Digital Compass
• Sensing Range: ±4g
• Interface: I²C
• Sensitivity: 7 Milli-Gauss
• Voltage - Supply: 2.5 V ~ 3.3 V
• Embedded: No
• Utilized Ic / Part: HMC5843
• Silicon Manufacturer: Honeywell
• Application Sub Type: Magnetic Sensor
• Kit Application Type: Sensing - Magnetic / Compass
• Silicon Core Number: HMC5843
• Sensitivity Range: +/- 10 %
• Sensor Terminals: PCB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 342-1072

HMC5843
PACKAGE OUTLINES
PACKAGE DRAWING HMC5843 (20-PIN LPCC, dimensions in millimeters)
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5843.
PCB Pad Definition and Traces
The HMC5843 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.40mm by
0.25mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Lead finish is SnAgCu. Size the traces between the HMC5843
and the external capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
No special profile is required for the HMC5843 and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC5843 may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
substrate. Irons with a tip temperature no greater than 315°C should be used. Excessive rework risks the copper pads
pulling away into the molten solder.
4
E2
Pin 1
L
D3
HMC5843 – bottom view
D2
D
e
E
A
Sym
D2
D3
E2
A
D
E
e
L
1.20
Min
www.honeywell.com
0.25 x 20 pins
0.40 x 20 pins
0.50 Basic
4.0 BSC
4.0 BSC
Nom
1.36
2.25
2.25
Max
1.46