TSSEVB Freescale Semiconductor, TSSEVB Datasheet
TSSEVB
Specifications of TSSEVB
Related parts for TSSEVB
TSSEVB Summary of contents
Page 1
... Touch Sensing Software Evaluation Board Users Guide Document Number:TSSEVBUG Rev. 6 7/2010 ...
Page 2
... The PowerPC name is a trademark of IBM Corp. and is used under license. All other product or service names are the property of their respective owners. © 1994-2008 ARC™ International. All rights reserved. © Freescale Semiconductor, Inc. 2009. All rights reserved. Document Number: TSSEVBUG Rev. 6 7/2010 ...
Page 3
... Freescale Semiconductor, Inc., 2009. All rights reserved. Touch Sensing Software Evaluation Board Users Guide, Rev. 6 Freescale Semiconductor Description of Changes Section 2.1.10, “Overlays” and Section 2.3.8.1, “Using the TSSEVB IIC Module” sections. Section 2.1.1, “TSSEVB Modules” and TSSEVB” sections. Section 3.1.1, “Re-Programming ...
Page 4
... TSSEVB Electrodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 2.2.9 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 2.2.10 Overlays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 2.3 Schematic and Bill of Materials (BOM 2-7 2.3.1 TSSEVB Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15 2.3.2 TSSEVB Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17 2.4 Header and Jumper Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17 2.4.1 USB Power Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17 2.4.2 External Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18 2 ...
Page 5
... USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.4 SCI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.5 OSBDM MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.6 Additional BDM Connector for MC9S08LG32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Touch Sensing Software Evaluation Board Users Guide, Rev. 6 Freescale Semiconductor v ...
Page 6
... About This Book This guide describes the hardware of the Touch Sensing Software Evaluation Board (TSSEVB). The TSSEVB provides all the necessary components to evaluate and use the Touch Sensing Software (TSS). TSSEVB is built around Freescale's TSS library. The Freescale MC9S08LG32 microcontroller unit uses the TSS library ...
Page 7
... IIC ICS LG MCU MCU OSBDM PC PCB QFN RAM Rx SCI SPI TSSEVB Tx Touch Sensing Software Evaluation Board Users Guide, Rev. 6 1-2 Bill of Material Central Processing Unit Communication Microcontroller Unit Electrode Graphing Tool Frequency-Locked Loop General-Purpose Input/Output Inter-Integrated Circuit Internal Clock Source MC9S08LG32 Microcontroller Unit ...
Page 8
... This chapter describes the basic components, functionality, and power supply options of TSSEVB. It also includes the schematic and Bill of Materials (BOM) for the TSSEVB. For more information on how to set the Freescale Touch Sensing Software primitives and the development environment, refer to the Touch Sensing Software API Reference Manual (document TSSAPIRM) ...
Page 9
... System Overview Figure 2-2 shows the back view of TSSEVB and the main modules present. 2.1.2 Microcontroller Unit (MCU) MC9S08LG32 drives liquid crystal displays (LCD) with up to 296 segments. The 5V segment LCD MCU, MC9S08LG32 offers improved performance and flexible pin functionality for a wide range of industrial Touch Sensing Software Evaluation Board Users Guide, Rev ...
Page 10
... TSSEVB uses the MC9S08LG32 Inter-Integrated Circuit (IIC) module to establish communication with the MC9S08JM60 Comm MCU when the TSSEVB is used along with EGT. To use the IIC module with the EGT, jumpers on headers J10 and J11 respectively must be properly configured. For more information ...
Page 11
... PTE1/LCD9 PTE2/LCD10, PTE3/LCD11 PTE4/LCD12 PTE5/LCD13 PTE6/LCD14 PTE7/LCD15 PTF0/TX1/KBI3/TPM2CH2/ADC12 PTF1/RX1/TPM1CH0/ADC13 PTF2/SPSCK/TPM1CH1/IRQ/ADC14 PTF3/SS/KBI0/TPM2CH5 Touch Sensing Software Evaluation Board Users Guide, Rev. 6 2-4 Table 2-1. GPIO Port Allocation (continued) TSSEVB Functionality ESLIDER7 ESLIDER8 ESLIDER3 ESLIDER4 ESLIDER5 ESLIDER6 LCD16 LCD17 LCD18 LCD19 LCD20 MAIN_BKGD MAIN_RST ...
Page 12
... PTI3/TPM2CH2/MOSI PTI4/TPM2CH1/SDA/SPSCK PTI5/TPM2CH0/SCL/SS 2.1.4 Power Supply Power can be supplied to TSSEVB either through the USB connections by setting J4 or through an external power supply. • To supply power to the TSSEVB through a USB connection, set the J4 jumper to the selected USB connection. Touch Sensing Software Evaluation Board Users Guide, Rev. 6 Freescale Semiconductor Table 2-1 ...
Page 13
... LCD TSSEVB provides a custom LCD with special segments that can be used to represent each of the electrodes featured in the board. Depending on the application, these segments can change their functionality. When running the application demo, the LCD allows you to visualize the performance of the electrodes working along with the TSS ...
Page 14
... Overlays TSSEVB includes two detachable overlays provided by KEE Group. These overlays have an adhesive that can be used to place the overlay over the electrodes. These overlays can be used to test different dielectric constants placed over the electrodes. The overlays can be placed, and removed many times while retaining adherence ...
Page 15
...
Page 16
...
Page 17
...
Page 18
...
Page 19
...
Page 20
...
Page 21
...
Page 22
... ST MICROELECTRONICS 22 1 FREESCALE SEMICONDUCTOR KINGBRIGHT 25 8 KINGBRIGHT Touch Sensing Software Evaluation Board Users Guide, Rev. 6 Freescale Semiconductor Table 2-2. TSSEVB Bill of Materials Manufacturers.Mfr. Part Number NTC-T106M16TRAF KEMET C0603C104K3RAC KEMET C0603C474K4PAC PANASONIC ECJ1VB0J106M KEMET C0805C103KARACTU AVX TACL475K010R AVX 06033A300KAT2A PANASONIC EXCML20A390U KEYSTONE ...
Page 23
... System Overview Table 2-2. TSSEVB Bill of Materials (continued) Item BOM.Qty Manufacturers.Mfr. Name VENKEL COMPANY INTERTECHNOLOGY 33 14 VENKEL COMPANY SEMICONDUCTOR 35 1 SEMTECH CORP 36 1 INTERTECHNOLOGY Touch Sensing Software Evaluation Board Users Guide, Rev. 6 2-16 Manufacturers.Mfr. Part Number KOA SPEER RK73B1JTTD103J CR0603-10W-102JT BOURNS ...
Page 24
... To supply power to the TSSEVB with the USB OSBDM source, place the jumper on 1–2 position. Figure 2-4. Jumper Placement for USB OSBDM Source 2. To supply power to the TSSEVB with the USB COMM source, place the jumper on 2–3 position. Figure 2-5. Jumper Placement for USB COMM Source Touch Sensing Software Evaluation Board Users Guide, Rev ...
Page 25
... Voltage Selection The system can be operated 3.3 V. Place a jumper on J5 for voltage selection supply the TSSEVB, place the jumper on 1–2 position supply 3 the TSSEVB, place the jumper on 2–3 position. Touch Sensing Software Evaluation Board Users Guide, Rev. 6 2-18 Input voltage: +6. +26 V 2.0 mm – ...
Page 26
... MC9S08LG32 MCU, place the jumper on position 1 select the MC9S08JM60 Comm MCU as a communication device for the Rx SCI signal of the MC9S08LG32 MCU, place the jumper on position 2-3 on J2. 2.3.5 Test Points TSSEVB includes several test points for electrical test. Test Point TP1 TP2 TP3 TP4 Touch Sensing Software Evaluation Board Users Guide, Rev ...
Page 27
... To connect the SCL signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place the jumper on J10. Touch Sensing Software Evaluation Board Users Guide, Rev. 6 2-20 J6 BDM Header J6 BDM Header 1 2 RX1 3 4 TX1 5 6 SCL 7 8 SDA 9 10 GND Freescale Semiconductor ...
Page 28
... Using the TSSEVB IIC Communication Module You can use the TSSEVB board to monitor the capacitance variations on the electrodes form your application. The TSSEVB features a Communication MCU that communicates every TSS application with the Electrode Graphing Tool Software. This section discusses the steps required to use the TSSEVB communication module as a bridge between your application and the Electrode Graphing Tool (EGT) software ...
Page 29
... Figure 2-13. Connections Between the TSS Application Hardware and the TSSEVB Board 5. After you have set all the connections, turn on the TSS application hardware and the TSSEVB board, then launch the EGT software. The GUI should start showing the electrodes capacitance measurements ...
Page 30
... Ensure that you have installed the latest version of CodeWarrior Development Studio, available on the Freescale web site at www.frescale.com. 2. Download the latest version of the TSSEVB USB Bridge file from the Freescale web site at www.frescale.com/touchsensing. 3. Connect the PC to the MC9S08JM60 Comm MCU USB connector. To locate the MC9S08JM60 Comm MCU USB connector, refer to Section 4. Select the MC9S08JM60 Comm MCU as target of the OSBDM by setting jumpers on position 1– ...
Page 31
... Additional BDM Connector for MC9S08LG32 The connector for an external BDM is also included in the TSSEVB board. This enables you to use an external BDM to program MC9S08LG32. To enable the external BDM, leave the jumpers on J6 either disconnected, or connected to the Communications MCU between 1-3 and 2-4. ...