TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 31
![BOARD EVAL PT100 RTD TEMP SENSOR](/photos/9/17/91791/tmpsns-rtd1_sml.jpg)
TMPSNS-RTD1
Manufacturer Part Number
TMPSNS-RTD1
Description
BOARD EVAL PT100 RTD TEMP SENSOR
Manufacturer
Microchip Technology
Datasheets
1.MCP3301-CIMS.pdf
(32 pages)
2.PCM18XR1.pdf
(438 pages)
3.MCP6S22DM-PICTL.pdf
(43 pages)
4.TMPSNS-RTD1.pdf
(26 pages)
Specifications of TMPSNS-RTD1
Sensor Type
Temperature
Interface
USB
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP3301, MCP6S26, PIC18F2550
Processor To Be Evaluated
MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
Data Bus Width
12 bit
Interface Type
USB
Lead Free Status / RoHS Status
Not applicable / Not applicable
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2003 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
§
Units
2
1
A2
A1
E1
B1
eB
E
D
B
n
p
A
L
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.058
.018
.370
.012
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MCP6S21/2/6/8
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
DS21117A-page 31
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15