MAX9945EVKIT+ Maxim Integrated Products, MAX9945EVKIT+ Datasheet - Page 2

• Manufacturer Part Number: MAX9945EVKIT+
• Description: EVALUATION KIT FOR MAX9945
• Manufacturer: Maxim Integrated Products

Specifications of MAX9945EVKIT+

• Channels Per Ic: 1 - Single
• Amplifier Type: General Purpose
• Output Type: Single-Ended, Rail-to-Rail
• Slew Rate: 2.2 V/µs
• Current - Output / Channel: 25mA
• Operating Temperature: -40°C ~ 125°C
• Current - Supply (main Ic): 400µA
• Voltage - Supply, Single/dual (±): 4.75 V ~ 38 V, ±2.4 V ~ 19 V
• Board Type: Fully Populated
• Utilized Ic / Part: MAX9945
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -

38V, Low-Noise, MOS-Input,
Low-Power Op Amp
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V
IN+, IN-, OUT Voltage......................(V
IN+ to IN- .............................................................................±12V
OUT Short Circuit to Ground Duration....................................10s
Continuous Input Current into Any Pin .............................±20mA
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
unless otherwise noted.) (Note 2)
TDFN-EP
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
DC ELECTRICAL CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current (Note 3)
Common-Mode Rejection Ratio
Open-Loop Gain
Output Short-Circuit Current
6-Pin TDFN-EP (derate 23.8mW/°C above +70°C)
CC
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Multilayer Board ....................................................1904.8mW
_______________________________________________________________________________________
= +15V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
EE
CC
= -15V, V
to V
EE
) ..................................-0.3V to +40V
IN+
= V
A
= +70°C)
IN-
SYMBOL
V
EE
V
= V
IN+
CMRR
OS
V
A
- 0.3V) to (V
I
I
SC
OS
GND
OL
JC
B
, V
- T
) ...................9°C/W
IN-
JA
C
= 0V, R
) ............42°C/W
Guaranteed by
CMRR
T
T
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
V
T
V
T
V
R
V
R
A
A
A
A
CM
CM
EE
EE
OUT
OUT
CC
= +25°C
= T
= +25°C
= T
+ 0.3V ≤ V
+ 0.75V ≤ V
OUT
= V
= V
+ 0.3V)
= 100kΩ to GND
= 10kΩ to GND
MIN
MIN
EE
EE
= 100kΩ to GND, T
A
A
A
A
to T
to T
≤ +25°C
≤ +70°C
≤ +85°C
≤ +125°C
to V
to V
MAX
MAX
OUT
CONDITIONS
CC
CC
OUT
- 1.2V,
- 1.4V,
≤ V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature ....................................................+260°C
µMAX
≤ V
8-Pin µMAX (derate 4.8mW/°C above +70°C)
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance θ
CC
Multilayer Board ......................................................387.8mW
CC
T
T
A
A
- 0.3V,
= +25°C
= T
- 0.75V,
A
MIN
= -40°C to +125°C, typical values are at T
to T
MAX
MIN
V
V
110
110
78
78
EE
EE
TYP
±0.6
130
130
50
94
94
25
2
JC
...................42°C/W
JA
V
V
MAX
) .......206.3°C/W
150
1.9
1.2
1.4
CC
CC
±5
±8
12
55
-
-
A
= +25°C,
UNITS
µV/°C
mV
nA
mA
pA
pA
dB
dB
fA
V