HFA1110EVAL Intersil, HFA1110EVAL Datasheet
HFA1110EVAL
Specifications of HFA1110EVAL
Related parts for HFA1110EVAL
HFA1110EVAL Summary of contents
Page 1
... V- HFA1110IBZ (Note) HFA1110EVAL High Speed Buffer DIP Evaluation Board NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil ...
Page 2
Absolute Maximum Ratings Voltage Between V+ and .12V DC Input Voltage ...
Page 3
... Evaluation Board shown below. Evaluation Board An evaluation board is available for the HFA1110 (part number HFA1110EVAL). Please contact your local sales office for information. The layout and schematic of the board are shown here: NOTE: The SOIC version may be evaluated in the DIP board by using a SOIC-to-DIP adapter such as Aries Electronics Part Number 08-350000-10 ...
Page 4
Typical Performance Curves 120 -40 -80 -120 TIME (5ns/DIV) FIGURE 1. SMALL SIGNAL PULSE RESPONSE PHASE - 200mV OUT P 200M 400M 600M FREQUENCY ...
Page 5
Typical Performance Curves 0.25 0.20 0.15 0.10 0.05 0 -0.05 -0.10 1M 10M FREQUENCY (Hz) FIGURE 7. GAIN FLATNESS -20 -30 GAIN -40 -50 - OUT 0 200M 400M 600M FREQUENCY (Hz) FIGURE 9. REVERSE GAIN AND ...
Page 6
Typical Performance Curves 0.8 0.4 0.2 0 -0.2 -0.4 -0 TIME (ns) FIGURE 13. SETTLING RESPONSE 200 300 400 500 600 700 INPUT RISE TIME (ps) ...
Page 7
Typical Performance Curves -60 -40 - TEMPERATURE (°C) FIGURE 19. BIAS CURRENT vs TEMPERATURE 3.8 3.7 3.6 3 100Ω) ...
Page 8
Die Characteristics DIE DIMENSIONS: 63 mils x 44 mils x 19 mils 1600µm x 1130µm x 483µm METALLIZATION: Type: Metal 1: AlCu(2%)/TiW ±0.4k Å Å Thickness: Metal 1: 8k Type: Metal 2: AlCu(2%) ±0.8k Å Å Thickness: Metal 2: 16k ...
Page 9
... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...