EK13 Cirrus Logic Inc, EK13 Datasheet

EK13

Manufacturer Part Number

EK13

Description

EVALUATION KIT FRO PA241DF

Manufacturer

Cirrus Logic Inc

Series

Apex Precision Power™r

Datasheets

1.EK13.pdf (2 pages)

2.EK13.pdf (3 pages)

Specifications of EK13

Channels Per Ic

1 - Single

Amplifier Type

Power

Output Type

Single-Ended

Board Type

Bare (Unpopulated)

Utilized Ic / Part

PA241DF

Product

Amplifier Modules

Description/function

Audio Amplifiers

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Operating Temperature

Current - Output / Channel

Voltage - Supply, Single/dual (±)

-3db Bandwidth

Slew Rate

Current - Supply (main Ic)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Other names

598-1459
EK13

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Company

Part Number

Manufacturer

Quantity

Price

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Part Number:

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Part Number:

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INTRODUCTION

IS possible with the EK13 evaluation kit. The ampliﬁer may

be surface mounted directly to the PC board. The PA241DF

is soldered to a 2-square inch area of foil on the PC board for

heat sinking. This foil heat sink is connected to–Vs. Connec-

tions are provided for required power supply bypassing, phase

compensation components, and a current limit resistor. A large

area for component mounting provides ﬂexibility and makes a

multitude of circuit conﬁgurations possible.

PARTS LIST

Part #

EVAL15

OX7R105KWN

HS24

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

Fast and easy breadboarding of circuits using the PA241DF

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Description

PC Board

1µF Ceramic Capacitor

Heatsink

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Quantity

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ASSEMBLY

assembled to the EVAL15 PC board using surface mount

processes. Solder paste may be dispensed or screen-printed

on the DUT pads. The heat tab on the back of the PA241DF

provides maximum heat dissipation capabilities when soldered

to the PCB metalization that runs under the DUT on the DUT

side of the board. Solder should be applied here also. For

prototype purposes, the tab can be thermally connected to the

PCB metalization using thermal grease.

using a solder reﬂow furnace. If this is not available, a heat

plate capable of solder reﬂow temperatures may be used. or,

though time consuming, the leads may be soldered individually

to the PCB with a soldering iron. In this case the use of thermal

grease under the heat tab is recommended instead of solder

for the thermal connection.

CAUTION

The PA241DF is a surface mount device and should be

The PA241DF and HS24 should be reﬂowed to the PCB

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High voltages will be present. Use caution in

handling and probing when power is applied.

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Related parts for EK13

EK13 Summary of contents

Page 1

... INTRODUCTION Fast and easy breadboarding of circuits using the PA241DF IS possible with the EK13 evaluation kit. The ampliﬁer may be surface mounted directly to the PC board. The PA241DF is soldered to a 2-square inch area of foil on the PC board for heat sinking. This foil heat sink is connected to– ...

Page 2

... APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All speciﬁcations are subject to change without notice. 2 EK13U REV C NOVEMBER 2004 © 2004 Apex Microtechnology Corp. EVALUATION KIT FOR PA241DF PIN-OUT ...

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